Used AMAT / APPLIED MATERIALS P5000 Mark II #9356928 for sale
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ID: 9356928
Wafer Size: 8"
PECVD System, 8"
(3) Chambers
Process: TEOS, TEB, TEPO
Throttle valve, P/N: 0010-76174
SACVD Gas box
Pressure transducer, P/N: 122BA-01000EB-S
Transducer, P/N: 627A-13267
Mass Flow Controller (MFC), P/N: LF-310A-EVD
Gases: N2, O2, NH3, He
(3) Lamp assemblies, P/N: 0010-09978
(3) RF Match assemblies, P/N: 0010-09750
(3) 5000 / 5200 CVD C-Plug throttle valves, P/N: 0010-37151
Remote control liquid injector, P/N: 0010-09886
ASTEX AX8200 Ozone generators:
(2) AX8200A-CE, P/N: 0190-35870
AX8200A, P/N: 0190-09437
(3) ENI OEM-12B RF Generator, 1250 W
(3) ADCS Gas box and controllers
(3) ADCS A1 Signal interface modules
(3) ADCS Automatic purge controllers
(3) ADCS BRC 22A Integrated refill controllers
(3) ADCS 969 Low level monitors
Ozone generator rack
Gas, shower head box
Cables.
AMAT / APPLIED MATERIALS P5000 Mark II Reactor equipment is a state-of-the-art reactor designed for semiconductor-related production. AMAT P5000 Mark II reactor is ideal for anything from thin-film deposition to etch processing. With a variety of process chambers, the Mark II reactor can achieve the perfect balance between precision and performance. Equipped with advanced features, such as thermal uniformity, pressure control and a low-cost electronic sub-system, the Mark II reactor provides the user with a quality deposition and etching experience. APPLIED MATERIALS P 5000 MARK II reactor contains a unique feature known as the Dual-Beam Multi-Process Chamber (DBMPC). This chamber feature is a multi-functional chamber that is capable of combining two atomic beam source processes in a single chamber. This provides the user with the flexibility to perform both deposition and etching processes within a single chamber. The Mark II reactor utilizes a low-cost electronic sub-unit to allow for precise control of the substrate temperature within the chamber environment. The machine is capable of reaching temperatures of 600°C, with temperature uniformity of within 1% over the entire substrate. The temperature uniformity is enhanced by an efficient vacuum tool, keeping the chamber pressure low and stable. The Mark II reactor is equipped with an advanced process gases mixing program. The mixing program controls time, flow rate, pressure and temperature in order to achieve desired process results. This feature allows for accurate process control, allowing for processes to be done with an extremely high level of accuracy and repeatability. The Mark II reactor is also designed with a safety asset to protect the user and the equipment. The safety model includes multiple safety sensors, temperature sensors and interlocks to ensure user safety and operating equipment reliability. AMAT P 5000 MARK II Reactor equipment is an ideal choice for semiconductor-related production. With advanced features, precise temperature control, advanced process gases mixing and a safety system, it is no surprise the Mark II reactor is a top choice for users in the semiconductor industry.
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