Used AMAT / APPLIED MATERIALS P5000 Mark II #9411642 for sale
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ID: 9411642
Wafer Size: 6"
System, 6"
Hard Disk Drive (HDD) SDD Flash hard
Floppy Disk Dive (FDD), 3.5"
Storage elevator: 8-Slots
Cassette indexer: Standard clamp type
(3) Chambers
Process chamber: ABD, PE-SiO2
(3) Baratron gauges: MKS 122BA, 10 Torr
(3) One hole chambers
Standard robot blade
(3) ENI OEM 12B RF Generators
(3) Gas panels
NUPRO/FUJIKIN Pneumatic/Shut-off valve
(3) RF Matchers standard
(3) Slit valves standard
(3) Throttle valves, C-plug
(3) Susceptors P-chuck, 6"
(3) Process kits
O-Ring
(42) Lamps
Mini controller
Remote AC Rack standard type
Remote AC Rack to MF cable, 55 feet
Remote monitor cable, 25 feet
Pump/Heat exchanger cable, 25 feet
AMAT-0 Heat exchanger
Heat exchanger water hose color flex, 55 feet
(15) HORIBA Z512 / GF 100
SiH4 300 SCCM / N2O, (3) SLM / N2 (5) SLM / CF4 5000 SCCM / N2-s 100 SCCM
(2) LCD Touch / Light pen monitors
(2) Monitor racks.
AMAT / APPLIED MATERIALS P5000 Mark II (AMAT) reactor is a dynamic, high-performance plasma etch and deposition equipment designed to meet the most demanding requirements of semiconductor device fabrication. Featuring robust performance, high throughput, and excellent precision, this tool is one of the most advanced materials processor for thin film deposition and etching. The reactive ion etch process uses source gases and plasma to etch away material at the sub-micron level. The system is equipped with a automated pre- and post-clean technology with enhanced process control and spectral analysis. The advanced control unit is capable of very fine tuning of the RF frequencies, chamber pressure, gas flow and roll control. The entire machine is integrated with a user-friendly software package, enabling desktop control and sophisticated automation. The tool is equipped with multi-chamber loading technology, allowing up to 16 simultaneous processing operations. The unique design of loading and processing zones enable independent recipes or recipes that span across multiple sources, allowing for simultaneous deposition and etching operation. This gives the flexibility for a wide range of applications, from low-pressure and high-pressure etch, to homogenous thin film deposition and multi-layer step deposition. The Mark II reactor utilizes advanced vacuum chamber and gas delivery asset, to maintain repeatable and reproducible process results. The vacuum feature enables the production of high-quality coatings for thin film deposition and etching process. The reliable gas delivery model is able to maintain the desired gas pressure and composition for the highly precise etching process. For increased safety, the Mark II reactor comes with additional safety features, such as; energy monitoring, gas safety, temperature control, grounding and pressure sensing. The optical pyrometer allows temperature control to maintain uniformity of temperature in deposition and etching process. In addition, the built-in multiple view monitoring technology provides continuous visual verification of the process. Overall, AMAT P5000 Mark II reactor is an innovative plasma etching and deposition equipment, precisely designed to meet the most demanding requirements of semiconductor device fabrication. Featuring versatile automation, robust performance, and high throughput, the system offers state-of-the-art technology combined with user-friendly software, to ensure reliable and reproducible process.
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