Used AMAT / APPLIED MATERIALS P5000 #131577 for sale

AMAT / APPLIED MATERIALS P5000 is an advanced PECVD reactor designed for depositing film patterns onto substrates. The equipment can accurately and reliably reproduce the patterned film for a wide range of applications such as Thin Film Transistor (TFT) displays and MEMS (microelectromechanical systems). AMAT P-5000 is a single-wafer processor ideal for high-yield production and rapid cycle rates. APPLIED MATERIALS P 5000 PECVD reactor is equipped with nine chambers, each capable of handling up to 200 processes per hour. There are three chambers for deposition of silicon oxides, nitrides, and a-Si:H for thin film transistor applications. Additionally, AMAT / APPLIED MATERIALS P 5000 includes three chambers for special deposition such as Silicon Nitride and Silicon OXIDE-Nitride-Oxide (SiON). The chamber arrangement provides an efficient solution for the simultaneous deposition of multiple materials. The chemicals used in P-5000 PECVD-reactor are tailored to the specific application and are housed in special chemical reservoirs. The process chamber is capable of controlling and maintaining temperatures of up to 425°C, enabling fine-tuning of the deposition thickness and formation of nanoscale features. APPLIED MATERIALS P5000 utilizes a number of different gases, such as Nitrogen, Chlorine, and Hydrogen, making it possible to deposit thin film structures with minimal contamination. AMAT P5000 also incorporates various safety features and automated maintenance functions, ensuring safe and efficient operation with minimal process downtime. An advanced flow control system is implemented to ensure the accurate delivery of chemicals for consistent and high-quality wafer production. In addition, the unit is equipped with a fully automated onboard calibration and test unit that can be used to ensure the integrity of all process steps. P5000 PECVD reactor is a versatile and reliable tool for the reliable deposition of patterned film structures. Utilizing proven techniques, the unit can be used to deposit a wide range of materials with high precision, providing superior thin film structures with a minimal amount of processing time. The machine's robust design, automated features, and safety systems make it an ideal choice for wafer processing.