Used AMAT / APPLIED MATERIALS P5000 #189955 for sale

AMAT / APPLIED MATERIALS P5000
ID: 189955
System, 6" (3) MxP (not MxP+) chambers Mechanical clamp (not ESC).
AMAT / APPLIED MATERIALS P5000 reactor is a type of chemical vapor deposition (CVD) system which is used for the growth of thin films on various substrates as part of the fabrication of integrated circuits, semiconductor devices and associated materials. AMAT P-5000 is designed specifically to provide high-quality deposition of nanoscale thin films with sub-micron line-width variation and excellent uniformity across large substrates. The wide process flexibility of APPLIED MATERIALS P 5000 enables use for production of a variety of systems and components such as logic, memory, display and photovoltaic devices. The basic concept of P5000 system is a deposition chamber which is positioned between a plasma source and a substrate chamber. The process gas is introduced into the chamber and passes into the plasma source, where it is excited and broken down into reactive species which are then directed at the substrate to create films. P-5000 offers multiple advantages over other CVD systems, including higher throughput and improved performance due to its improved uniformity and precision. Its processor-controlled plasma source has the capability to independently control the RF power and bias voltage to create plasmas of different densities and energies. This, combined with a dual shield that helps reduce the background level of noise and disturbances in the chamber, allows for improved throughput and high-quality films. AMAT P 5000 also has improved temperature monitoring and control, making films with better uniformity possible. It utilizes large-area heaters and K-type thermocouples for precise temperature control and monitoring. Additionally, the dual stainless steel walls of the chamber form a conductive shield, allowing for more stable temperatures, lower thermal gradients and greater uniformity across large area substrates. APPLIED MATERIALS P-5000 also provides a pulsed deposition option, which reduces temperature and stress on the substrate during deposition and significantly reduces the time required to grow films. The pulsing of the source of reactant is enabled by the processor-controlled plasma source, allowing precision control of the film deposition rate while significantly reducing energy consumption and substrate damage. All of these features contribute to P 5000's assessment as a premium CVD system among its peers, offering the best combination of performance and throughput for a wide range of materials. It is an ideal device for those looking for a reliable and efficient CVD reactor for their production needs.
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