Used AMAT / APPLIED MATERIALS P5000 #293610276 for sale

AMAT / APPLIED MATERIALS P5000 is a high-tech plasma reactor designed for precision etching and deposition processes used in advanced semiconductor manufacturing. The reactor features a processor-controlled vertical chamber geometry design, capable of delivering a range of process parameters in a tightly-controlled gas environment. Utilizing a 450mm-wide low-pressure plasma chamber, AMAT P-5000 allows extremely accurate etching and deposition steps by recognizing wafer characteristics such as flatness and thermal expansion rate. Moreover, the process pressure control system and the adaptive process control booster help achieve the desired chemistry and deposition rate with astonishing precision. APPLIED MATERIALS P 5000 has the advantage of controlled Ar-Nitrogen plasma with in-situ deposition stages. This multitasking reactor is also capable of introducing dopants with high reactivity and excellent selectivity, enabling accurate adjustment of the device parameters of diodes, memories, and switches. The ultra-high-speed model of the Applied Material AMAT / APPLIED MATERIALS P 5000 enables a deposition rate of up to 20 nm per minute. This helps in quickly reconnecting atoms that have been previously broken apart or have drifted away. It also allows for the processing of several layers at the same time, thereby reducing the number of steps and time needed for element integration. In addition, P 5000 integrates a real-time temperature-based process control system. This helps reduce the number of reticles needed, while ensuring accuracy of the etching and deposition process. Furthermore, the Enhanced P/N Closure feature helps avoid short-circuits and maximize the yields of the dies. Also, the Automatic End Point Measurement feature productively monitors and examines the device process steps in an extensive range of settings. Overall, APPLIED MATERIALS P5000 is a powerful and highly configurable reactor that can be used in a wide range of semiconductor etching and deposition processes. It is capable of providing precise process parameters and automated temperature-assisted process control, which ensures consistency and high yields with minimized reticles.