Used AMAT / APPLIED MATERIALS P5000 #9058266 for sale

AMAT / APPLIED MATERIALS P5000 Reactor is an advanced plasma-enhanced chemical vapor deposition (PECVD) reactor that is highly efficient and reliable. This tool enables large process chambers, a high degree of substrate uniformity, and tight within-wafer uniformity. AMAT P-5000 Reactor also employs low-pressure operation to increase throughput while minimizing wafer stress and providing improved film uniformity. The main components of APPLIED MATERIALS P 5000 Reactor include a plasma cluster source, a two-coil inductively coupled power delivery system, and a low-pressure process chamber. The plasma cluster source uses a series of parallel-connected capacitors that contain three high-density, wire-wrapped electrode segments. This electrode configuration produces uniform, high-performance plasma clusters that are optimized for PECVD. The two-coil inductively coupled power delivery system features a large center electron beam coil to produce large stable plasma fields, and a more compact surrounding coil to deliver the necessary power for the process tightly and precisely. The low-pressure process chamber features a single-piece bell- shaped design that enables wide uniformity across the wafer and within-wafer uniformity by minimizing components that could create hot spots. The low-pressure operation of the chamber also allows for higher throughput rates. AMAT / APPLIED MATERIALS P-5000 Reactor provides high-speed deposition rates, uniform substrate coverage, a wide range of process conditions, and compatibility with a variety of PECVD-compatible materials. This tool is an ideal solution for producing wafers with tight critical dimension control and low defect levels. AMAT / APPLIED MATERIALS P 5000 Reactor can be used to produce a range of advanced coatings, including silicon-based dielectrics and metals. This tool can also help to create nanostructures, ultrasensitive gases sensors, and other types of nanoscale architectures. APPLIED MATERIALS P-5000 Reactor is optimized for performance, reliability, and cost-effectiveness. This tool is an excellent choice for semiconductor manufacturers, as it provides tight uniformity and excellent throughput. Additionally, its low-pressure process chamber and two-coil inductively coupled power delivery system makes it ideal for creating critical layers with uniformity across the substrate.