Used AMAT / APPLIED MATERIALS P5000 #9111886 for sale
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ID: 9111886
Wafer Size: 6", convertible to 8"
Vintage: 1992
Metal etcher, 6", convertible to 8"
Chamber A: MxP Metal, M-Chuck Type
Chamber B: MxP Metal, M-Chuck Type
Chamber C: ASP
Chamber D: N/A
Storage elevator: 29-Slot
Robot: Standard 6"
Cassette indexer: 6"
Chucking type: mechanical clamp
Chillers: (4) Dasan DHX-440D
Dry pumps: (4) Edwards QDP80
Gas scrubbers: (2)
Monitors: (2)
Power cables, RF cables, and signal cables
Chambers A Configuration:
Gas1 Bcl3 UNIT HFC 8160 200 Sccm
Gas2 N2 UNIT HFC 8160 100 Sccm
Gas3 Cl2 UNIT HFC 8160 100 Sccm
Gas4 N/A
Gas5 N/A
Gas6 N/A
Back He He MKS
Chamber Manometor MKS
Turbo Pump Seiko Seiki
Turbo Pump Controller Seiko Seiki SCU-21D
RF Generator ENI OEM-12B 1250W
RF Match AMAT
Chambers B Configuration:
Gas1 Bcl3 UNIT UFC-1160A 100 Sccm
Gas2 N2 UNIT UFC-1161A 100 Sccm
Gas3 Cl2 UNIT UFC-1160 100 Sccm
Gas4 O2 UNIT UFC-1163A 100 Sccm
Gas5 CF4 UNIT UFC-1164A 50 Sccm
Gas6 CHF3 UNIT UFC-1165A 100 Sccm
Back He He MKS
Chamber Manometor MKS 1Torr
Turbo Pump Seiko Seiki STB-301CB1
Turbo Pump Controller Seiko Seiki SCU-21D
RF Generator ENI OEM-12B 1250W
RF Match AMAT
Chamber C Configuration:
Gas1 N2 UNIT UFC1860 2SLM
Gas2 O2 UNIT UFC1160A 5SLM
Gas3 N/A
Gas4 NH3 UNIT UFC-8160 100 Sccm
Gas5 H2O VDS Tylen UC-4900MEPR 500Sccm
Chamber Manometor MKS 10Torr
Chamber Manometor MKS 100Torr
Microwave Generator ASTECK AX-2115 1500W
Currently de-installed
1992 vintage.
AMAT / APPLIED MATERIALS P5000 reactor is an innovative reactor equipment designed specifically to deliver versatile and cost-effective process solutions for advanced materials processing. It provides a comprehensive range of solutions to processes such as etching, deposition, oxidation, and annealing, while taking into account the cost and complexity associated with such processes. The system is available in both undersized and full scale configurations, and is suitable for a variety of materials, from dielectrics to metals. AMAT P-5000 reactor utilizes a patented combination of inductively-coupled RF plasma technology and an advanced electron cyclotron resonance source that is used to create a highly reactive oxygen-rich atmosphere for high-rate pulsed etch processes. This technology offers a range of advantages over conventional plasma sources, including higher etch rate, improved uniformity, and reduced process variations. In addition, APPLIED MATERIALS P 5000 is equipped with advanced numerical control systems and sophisticated software for the execution of jobs with improved accuracy. APPLIED MATERIALS P5000 is designed for high-throughput and repeatable processes, while producing uniform features with high repeatability and reproducibility. The reactor utilizes double-point chemical vapor deposition (CVD) technology, which provides a high deposition rate and uniformity. In addition, AMAT P 5000 can process films as thin as a single nanometer and large films as thick as 10 microns with deposition rate of up to one nanometer per second. P-5000 uses an automated substrate lifter for loading and unloading, which provides short cycle times and maximizes throughput. Its programmable process control handles multiple jobs simultaneously with advanced software algorithms to ensure that process recipes are optimized for each application. The automated loading and unloading unit is capable of providing high-precision results at extremely high speeds. P 5000 machine is also equipped with an advanced monitoring and diagnostics module, which includes several tool-level operations that allow users to monitor, diagnose, and troubleshoot asset performance and optimize equipment performance. It also offers a user-friendly software interface that is easy to use and understand. This ensures users can quickly and easily set up jobs and program the necessary processes required to complete their application. The advanced diagnostics and analysis features of AMAT P5000 allow users to quickly monitor and troubleshoot model performance in order to optimize their processes. AMAT / APPLIED MATERIALS P-5000 provides a comprehensive solution for advanced materials processing, with innovative technology and highly advanced control systems designed to allow for complex processes to take place with high precision and repeatability. The equipment is suitable for a range of materials, from nanometre thick films to 10 micron thick films and provides a range of advantages over traditional plasma sources. It also offers sophisticated software for easy programming and cycle times that are designed to maximize throughput.
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