Used AMAT / APPLIED MATERIALS P5000 #9133091 for sale
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ID: 9133091
Metal etch, 8"
System Features:
1. Top-Mounted electronics: NO
2. Meets CE Mark Requirements: NO
3. System monitors: YES
4. Robot Handler Rev: Phase III(Overhaul Complete)
5. Cassette Handler Rev: Phase III
6. Factor Automation: NO
7. Storage Elevator Position Sensor: NO
8. Storage Elevator Wafer Orienter: NO
9. Elevator Brakes: YES
10. Storage Elevator Slots: 8
11. Load Lock Purge: NO
12. Load Lock Chamber Bolt Down Lid: YES
13. Load Lock Lid Lift: NO
14. Wafer Position Sensor: YES
15. I/O Wafer Sensor: YES
16. Slow Pump Hardware Installed: NO
17. Foreline Fittings for TC and N2 Purge: VCR Type
18. Load Lock Pump Type: NO Pump
19. Load Lock Pump Brand: N/A
Mainframe
1. Load Lock Degasser: N/A
2. Wafer Orienter Chamber: N/A
3. Endpoint System: Extrenal Emmision
4. Neslab Water Plumbing on Facilities Panel: YES
5. Heat Exchanger Plumbing on Facilities Panel: YES
6. Endpoint System: NONE
7. Robot Type: Phase III
8. Robot Condition: Good condition
9. Lower Circuit Breaker Panel: Present
10. Buuffer Chamber Condition: Good condition
Electronics:
1. Boss PROM: Unable to check. System not powered up.
2. Single Board Computer Type: Synergy
3. Software Revision: Unable to verify, System not powered up.
4. Minicontroller: Present
5. Light Pens: NONE
6. Chamber Interconnect PCB: Present
7. Mini SBC PCB: Present
8. System Electronics Interface PCB: Present
9. Video PCB: Present
10. Analog Output PCB: Present
11. Analog Input PCB: Present
12. Stepper PCB's: Present
13. Digiral I/O PCB's: Present
14. TC Gauge PCB: Present
15. Chopper Drivers: One card none
16. DC Power Cards: +12v card none
17. Buffer I/O PCB: Present
18. AI / MUX PCB: Present
19. Magnet Drivers: 2 Drivers present for Etch Chambers
Chamber Information:
1. Chamber A: Metal Etch MxP+
2. Chamber B: Metal Etch MxP+
3. Chamber C: ASP(strip)
4. Wafer Size: 200mm
5. Foreline Hardware: All Present
6. Capacitance manometers: Present
7. Wafer Lift Hardware: Present, needs servicing and clean-up.
8. Roughing Valves: Present, will need PM serviced and cleaned.
9. Throttle Valve Assemblies: All chambers present. Will need PM Seriviced.
10. RF Matches: Type 4 Matches. Etch Chambers present.
Gas Box Information:
1. MFC Type: No MFC's in Gas Box at time of audit.
2. BCL3 MFC's:
3. CL2 MFC's:
4. CF4 MFC's:
5. N2 MFC's:
Remote Information:
1. Heat Exchanger: AMAT 1X 1
2. Chiller: HX-150
3. RF Generators:OEM-12A & AX-2115
4. Remote Frame: Stand Alone-Delta
1996 vintage.
AMAT / APPLIED MATERIALS P5000 is a 180mm dry etch reactor designed for high performance etching processes. The equipment is capable of providing highly precise etch depths, high uniformity, and excellent etch selectivity for a variety of materials. AMAT P-5000 is equipped with advanced hardware and software to ensure superior results for both planar and 3D structures. The hardware includes an RF Generator and an RF Matching Unit to maximize etching uniformity and efficiency. The system also includes a reactive gas delivery unit, deterministic motion control and closed loop RF delivery machine. In addition, APPLIED MATERIALS P 5000 features advanced control software such as EtchVision, a control graphical user interface (GUI) that provides easy control and customization of etch recipes. Furthermore, P-5000 has a dielectric based etch chamber built to minimize RF reflections in the plasma chamber, reducing the possibility of RF artifacts in sensitive areas. APPLIED MATERIALS P5000 is designed to etch the most difficult of materials such as molybdenum, tungsten, and ruthenium. It is also capable of etching in multiple layers of dielectric without over-etch. AMAT P5000 also offers excellent oxide etch characteristics with minimum heating, cooling, and uncontrolled ion impacts. The tool can be used for deep etches and works well for both substrate cleaning and surface cleaning steps. AMAT P 5000 is a powerful tool for etching that can provide uniform, precise, and high-performance results for a variety of materials. Its combination of advanced hardware and software enable users to reach their desired process goals with minimal effort. The asset is well suited for applications in microelectronics, semiconductor, and optoelectronics industries for etching sensitive and challenging structures.
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