Used AMAT / APPLIED MATERIALS P5000 #9164732 for sale

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ID: 9164732
Wafer Size: 6"
Vintage: 1992
Etcher, 6" Mainframe configuration: Mainframe type: Mark II I/O Wafer sensor: Yes Software revision level: TBD Expaneded VME: Yes Mini-controller: Yes Phase 3 Robot: Yes Phase 3 cassette handler: Yes Storage elevator (8) Slots Cassette platform: Standard Wafer orienter: No L/L Chamber bolt down lid: No L/L Particle reduction kit: No Gas Panel: MFC manufacturer / model: UFC-1100A Gas panel type: Twelve lines main: No Twenty-eight line onboard: No Standard gas panel (28 Line capability): Yes Remote gas panel: No Chamber A MFC Size Gas Cal Gas Gas 1 slm O2 N2 Gas 2 slm O3 He Gas 3 slm C2F6 N2 Gas 3 slm NF3 N2 Gas 200 sccm N2 N2 Gas Gas Gas Chamber B MFC Size Gas Cal gas Gas 1 slm O2 N2 Gas 2 slm O3 He Gas 3 slm C2F6 N2 Gas 3 slm NF3 N2 Gas 200 sccm N2 N2 Gas Gas Gas Chamber C MFC Size Gas Cal gas Gas 300 sccm CF4 N2 Gas 100 sccm Ar N2 Gas 100 sccm O2$ O2 Gas 50 sccm O2 N2 Gas Gas Gas Chamber D MFC Size Gas Cal gas Gas 300 sccm CF4 N2 Gas 100 sccm Ar N2 Gas 100 sccm O2$ O2 Gas 50 sccm O2 N2 Gas Gas Gas Hot box configuration: Hot box configuration: Phase IV Ampoule 1: Yes Ampoule 2: No Ampoule 3: No Ampoule 4: No Ampoule 5: No Ampoule 6: No Ampoule 7: Yes Process kit configuration: Process application: Chamber A: CVD TEOS Chamber B: CVD TEOS Chamber C: Etch MxP Chamber D: Etch MxP System electronics: Slot # Description 1 MINI SBC: Yes 2 SBC: Yes 3 SEI: Yes 4 MIZER: No 5 AI: Yes 6 AO: Yes 7 VIDEO: Yes 8 AO: Yes 9 AI: Yes 10 STEPPER: Yes 11 STEPPER: Yes 12 STEPPER: Yes 13 STEPPER: Yes 14 DI/DO: Yes 15 DI/DO: Yes 16 DI/DO: Yes 17 DI/DO: Yes 18 DI/DO: No 19 DI/DO: No 20 DIO: No Floppy drive: 5 ¼ Chamber position dependent configurations: Chamber A: Chamber type: CVD Lid: STD Chamber rough line: Yes Chamber airline: Yes Chamber interconnect PCB: Yes Heat exchanger QD Fitting: Yes Neslab facilities plumbing: Yes Slit valve assembly: Yes Reminton hinge slit valve: Yes Automatic control gate valve: No Backing pump circuit breaker: Yes RF Generator power outlet: Yes RF Generator circuit breaker: Yes Magnet driver: No Lamp driver: Yes RF Match: Yes Turbo controller: No Turbo flow meter: No Gate valve: No Chuck type: Other susceptor Chamber B: Chamber type: CVD Lid type: STD Chamber rough line: Yes Chamber airline: Yes Chamber interconnect PCB: Yes Heat exchanger QD fitting: Yes Neslab facilities plumbing: Yes Slit valve assembly: Yes Reminton hinge slit valve: Yes Automatic control gate valve: No Backing pump circuit breaker: Yes RF Generator power outlet: Yes RF Generator circuit breaker: Yes Magnet driver: No Lamp driver: Yes RF match: Yes Turbo controller: No Turbo flow meter: No Gate valve: No Chamber vent valve: Yes Chuck type: Other susceptor Chamber C: Chamber type: MxP Lid type: STD Chamber rough line: Yes Chamber airline: Yes Chamber interconnect PCB: Yes Heat exchanger QD fitting: Yes Neslab facilities plumbing: Yes Slit valve assembly: Yes Reminton hinge slit valve: Yes Automatic control gate valve: Yes Backing pump circuit breaker: Yes RF Generator power outlet: Yes RF Generator circuit breaker: Yes Magnet driver: No Lamp driver: Yes RF match: Yes Turbo controller: Yes Turbo flow meter: No Turbo pump / controller type: Leybold Gate valve: No Chamber vent valve: Yes Chamber D: Chamber type: MxP Lid type: STD Chamber rough line: Yes Chamber airline: Yes Chamber interconnect PCB: Yes Heat exchanger QD fitting: Yes Neslab facilities plumbing: Yes Slit valve assembly: Yes Reminton hinge slit valve: Yes Automatic control gate valve: Yes Backing pump circuit breaker: Yes RF Generator power outlet: Yes RF Generator circuit breaker: Yes Magnet driver: Yes Lamp driver: No RF match: Yes Turbo controller: Yes Turbo flow meter: No Turbo pump / controller type: Leybold Gate valve: No Chamber vent valve: Yes Remote frame: Primary pump frame: No Secondary pump frame: No Stacked remote frame: yes Stacked remote frame contents: Heat exchanger Ozone generator (4) RF generators Number of heat exchanger: 1 Water hoses: No Hose fittings: QDC Backing Pumps: LL Chamber: No Chamber A: No Chamber B: No Chamber C: No Chamber D: No RF Generators: Chamber A: ENI 12A Chamber B: ENI 12A Chamber C: ENI 12A Chamber D: ENI 12A 1992 vintage.
AMAT / APPLIED MATERIALS P5000 vapor deposition reactor is a cutting-edge tool that enables intricate, reproducible, efficient and cost-effective thin-film deposition. AMAT P-5000 features a large, integrated and automated processing space that provides greater turnaround times and more options for substrate transfer. APPLIED MATERIALS P 5000 also utilizes AMAT industry-leading Aur plasma source that provides improved process capabilities, higher throughput and greater compliance with evolving industry needs. P-5000 is designed to reduce process time and increase throughput, while still providing optimal thin film deposition over a wide range of process flows. The system features the CIVAX process controller, which provides users with control of the entire deposition process from one compact, user-intuitive platform. It can be used to set, monitor and adjust parameters from up to four chambers, as well as store recipes for later access. AMAT P5000 also includes the Auralens enhanced deposition head that provides advantageously uniform deposition and conformal coverage for a range of films. AMAT P 5000 creates high accuracy films with excellent uniformity. It provides reproducible, reliable performance for all thin-film applications, ultimately fulfilling requirements for high performance films. The system enlarges substrate size range and can accommodate rectangular and round substrates, from small wafers up to 8-inch and up to 100mm discs. APPLIED MATERIALS P-5000 features expanded source flexibility, which allows users to customize deposition processes. APPLIED MATERIALS VaporMater deposition source enables chemical vapor deposition (CVD) of films using inorganic films and rare chemical precursor compounds. The system also offers AMAT / APPLIED MATERIALS PlanarMax Plasma Source, a planar plasma source designed to minimize undesirable deposition on neighboring wells. AMAT / APPLIED MATERIALS P 5000 vapor deposition reactor is an automated tool that provides improved process capabilities, higher throughput and greater compliance with evolving industry needs, while still providing optimal thin-film deposition over a wide range of processes. It features expanded source flexibility and increased substrate size capabilities, allowing users to achieve high accuracy films with excellent uniformity, reproducible and reliable performance for all thin-film applications.
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