Used AMAT / APPLIED MATERIALS P5000 #9168800 for sale
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ID: 9168800
PE Oxide deposition system, 6"
(2) DxZ Chambers
Silane, 6"
Currently installed
1997 vintage.
AMAT / APPLIED MATERIALS P5000 is a next-generation plasma-enhanced chemical vapor deposition (PECVD) reactor that is used to deposit wide range of thin-film devices, such as silicon-on-insulator (SOI) transistors, thin-film integrated circuits, and other optoelectronic materials. AMAT P-5000 is capable of operating in both batch and inline configurations and provides high-rate, high-quality thin-film deposition over large substrates, with the resulting materials having excellent device performance. The key to its superior performance is the use of an inductively-coupled plasma (ICP) source and a capacitively-coupled plasma (CCP) source. The ICP source generates a highly efficient and uniform plasma, which can be accurately tuned to modify the plasma-reaction rates, whereas the CCP source provides a relatively low plasma-reaction rate. The gas-flow distribution system of APPLIED MATERIALS P 5000 further optimizes the uniformity and reaction rate of the plasma created. In addition, APPLIED MATERIALS P-5000 utilizes a temperature controlled upper electrode, which is adjustable to up to 600°C. together with the ability to apply a negative bias to the electrodes, P-5000 provides excellent thin-film deposition results over large substrates. AMAT P 5000 further benefits from extremely low levels of particle and defect formation, due to the lack of particulate precursor sources and the use of an optimized gas-flow distribution system. In addition, the caoatively coupled plasma (CCP) source provides an effective means of ensuring good film-uniformity over large areas. Overall, AMAT / APPLIED MATERIALS P-5000 provides superior thin-film deposition results over large substrates and is an excellent choice for those looking for a high-quality, high-rate PECVD process. The use of the ICP source for greater efficiency and uniformity of the plasma, combined with the CCP source for providing lower reaction rates and better film-uniformity, and the ability to adjust the temperature and bias, make P 5000 an excellent all-around PECVD system.
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