Used AMAT / APPLIED MATERIALS P5000 #9171284 for sale

AMAT / APPLIED MATERIALS P5000 is a deposition reactor designed to deposit thin film coatings onto semiconductor wafers in a plasma environment. The reactor is specifically designed to work with semiconductor materials, such as silicon, silicon dioxide, three dimensional (3D) transistors and photonic integrated circuits. It is capable of delivering large wafer areas and easily handling sensitivities associated with fine line photolithography which leads to higher yields in the fabrication process. AMAT P-5000 chamber contains an octagonal pedestal with an advanced process lift mechanism. This allows accurate position and stability of the wafer during processing by maintaining constant distance between the wafer and the upper electrode. The lift mechanism can be used to reduce contamination and wafer breakage, as well as for fine tuning the processing parameters for different materials. APPLIED MATERIALS P 5000 achieves high uniformity throughout the deposition process by incorporating a unique dual-gun source design. The dual-gun features two electron cyclotron resonance (ECR) plasma source, which helps minimize non-uniformity. P-5000 also features a proprietary advanced power distribution module which ensures reliable and uniform power distribution from the ECR plasma source to the wafer. In addition to the power module, P5000 utilizes a patented gas deployment equipment for targeted gas deposition. This system controls multiple gas sources, and allows fine tuning of gas recipes to optimize deposition rates, uniformity, and deposition characteristics. A dedicated Software-Controlled Process Management unit serves as the 'brain' of the machine. This tool is designed to optimize process efficiency by automatically controlling recipe parameters and maintenance cycles. This reduces time to completion and increases production yields. Overall, AMAT P5000 is a highly versatile deposition reactor which is capable of delivering superior process results for a wide range of semiconductor applications. It delivers superior performance for both small-scale and large-scale deposition runs, as well as increased uptime and reduced costs compared to traditional deposition chambers.