Used AMAT / APPLIED MATERIALS P5000 #9186158 for sale

AMAT / APPLIED MATERIALS P5000 is a type of reactor used in chemical vapor deposition processes, specifically in the deposition of thin films on semiconductor wafers. This type of equipment provides an extremely uniform deposition of films across the entire surface of the wafer, making it ideally suited for the fabrication of complex electronic components. AMAT P-5000 is a temperature-controlled, horizontal multiple-source, rotating wafer reactor, designed for use in both low and high-pressure processing. Its design consists of two sources and eight showerheads, all arranged in a circular configuration. A single source is positioned in the center of the reactor and angled towards the showerheads. This design allows a uniform film deposition across the entire wafer surface, providing a high-quality product. APPLIED MATERIALS P 5000 is capable of operating at temperatures ranging from 500 to 950°C and is equipped with an infrared temperature sensor that monitors the uniformity throughout the entire wafer surface. Additionally, a closed-loop temperature control system facilitates precise temperature adjustment for uniform film deposition across the wafer and allows for the processing of both single layer and multilayer structures. At the top of the system is a vacuum chamber, which houses the showerhead assembly and shields it from the environment. This vacuum chamber houses a gas distributor, which helps ensure a uniform distribution of gas to the showerheads. The showerhead assembly consists of horizontal curved nozzles, arranged in what is essentially a rectangular pattern, with a round opening in the center and four additional nozzles in the corners of the circle. Adjacent to the vacuum chamber is the process chamber, which houses the substrates - typically silicon wafers - and is in direct contact with the showerheads. Inside the process chamber is a high-vacuum pump, which maintains the desired atmosphere in the chamber. Finally, AMAT P 5000 package includes top temperature and speed controllers, which enable precise control of the parameters of the chemical vapor deposition process. This ensures that materials are evenly deposited on the wafer and that material properties such as crystallinity and surface roughness are highly uniform. The combination of these controllers allows for optimal parameter settings for all types of film deposition.