Used AMAT / APPLIED MATERIALS P5000 #9276478 for sale
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ID: 9276478
CVD System
Process: Depo rate
Oxide: 6000 A/min
Uniformity: 5%
(12) Gases:
Gas no / Sccm / Gas
1 / 200 sccm / Sih4
2 / 100 sccm / NH3
3 / 3000 sccm / N2
4 / 2000 sccm / N20
5 / 2000 sccm / CF4 or SF6
7 / 200 sccm / Sih4
8 / 100 sccm / NH3
9 / 3000 sccm / N2
10 / 2000 sccm / N2O
11 / 2000 sccm / CF4 or SF6
AC Powers
Mainframe configration
Mark Ⅱ, 6"
I/O Wafer sensor
(21) VME Slots
Phase 3 Robot
Phase 3 Cassette handler
(8) Slots storage elevator
Viton O-ring
Clean gas box
Pressure control system
Throttle valve
Isolation valve open / close type
Temp control: Lamp heated
Vacuum system
Chamber: EDWARDS QDP80+QMB500 Pump.
Load lock chamber: ADP80
Nitrogen
Compressed air: CDA / N2
Exhaust
Fuse: AC/DC Power box.
RF Power supply: 1.2 kw and 13.56 Mhz
Power supply: 208 V, 200 A, AC Input, 3 Phase, 5 Wires.
AMAT / APPLIED MATERIALS P5000 is a physical vapor deposition (PVD) reactor. It is used to deposit thin films of ceramic, metal, dielectric or other materials over a substrate. This is completed with an ionized gas, or plasma, that transmits energy through the reactor chamber and onto the substrate. AMAT P-5000 reactor is designed to be a versatile and reliable solution for various thin film deposition applications. It consists of a three-component APPLIED MATERIALS P 5000 vessel, the reactor, a vacuum pump and the controller. The vessel is made out of stainless steel and is designed for fast maintenance. The reactor has a sample table which is used to control the substrate during the deposition process. P 5000 reactor relies on DC or pulsed DC magnetron sputtering technology to deposit the thin film materials. In DC sputtering, a DC voltage creates a plasma and ionizes the sputter target which is a substrate placed in the chamber. The plasma carries the sputtered material to the substrate. Pulsed DC sputtering uses high frequency power on the sputter target, which accelerates the sputtered material and increases the deposition rates of the thin films. APPLIED MATERIALS P5000 reactor chamber contains two primary components: the process zone and a pumpout zone. The process zone includes the sputter target, the sample table, and a resistive vaporizer. The target is typically made of tungsten or titanium and is heated by the DC voltage which is supplied to the target. The sample table, which is typically a low environmental background material such as quartz, is used to support the substrate during the deposition process. The resistive vaporizer acts as a source of material for the sputtering process. The pumpout zone consists of a cryopump and rotary and turbomolecular pumps for pumping out the process gases before and during the process and is used to create a vacuum within the chamber. These pumps can help provide a clean and stable process environment, reduce backstreaming and enhance the particle performance in the reactor. P5000 system can provide an efficient way of depositing multilayer films which can be used in a number of different applications, such as display, semiconductor, and optical. The fast, reliable, and versatile AMAT P5000 reactor can help manufacturers enhance their productivity and improve the quality of their products.
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