Used AMAT / APPLIED MATERIALS P5000 #9296351 for sale

ID: 9296351
System.
AMAT / APPLIED MATERIALS P5000 is a versatile, high-performance chemical vapor deposition (CVD) reactor equipment used for the advanced deposition of silicon based thin films. AMAT P-5000 is a horizontal reactor with a dual-chamber configuration. It is designed for advanced deposition processes that require precise control of temperature, pressure, and flow. The system features a top chamber for process chamber load-lock and a bottom chamber for load-lock control and wafer transfer. APPLIED MATERIALS P 5000 has advanced manageability features, including capable of automation processes, high temperature capability and low pressure operation, and precision process parameters. It can operate with standard Silicon CVD process gases and has an optional 300mm compatibility. The integrated gas management controls reaction temperature and is capable of detailed repeatable temperature monitoring and uniformity control. The unit also has a patented thermal confinement shell design that eliminates thermal stratification. The heated enclosure of AMAT / APPLIED MATERIALS P-5000 is designed to provide maximum repeatability of the process performance by allowing independent temperature and pressure control of the process gas in each of the two chambers. It also has upstream pressure regulation as well as a built-in wet/dry vacuum machine. P 5000 has advanced process controls such as automated recipe control, remote programmable process parameters and networking capabilities to monitor and control tool status and process parameters. It also features real-time monitoring and control of load-lock and wafer transfer systems. The integrated gas management asset, high temperature capability and low pressure operation all provide improved efficiency and repeatability. Finally, P-5000 features safety features such as emergency shutoff, audible and visual alarms and secure data transfer. The model is durable and reliable and is easily maintained, making it an excellent choice for advanced deposition processes such as sputtering and CVD.
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