Used AMAT / APPLIED MATERIALS P5000 #9383379 for sale
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ID: 9383379
CVD System
SNNF, 8"
Wafer shape: 25-Slot SNNF
Main frame:
Loadlock: Standard
Buffer chamber robot: Standard
Process chamber (PECVD): Position A, B and C
Cassette stage:
Position: A and B
Clamp on cassette
25-Slots
Storage elevator:
Center find
4-Slots
Buffer chamber:
Buffer type: Standard
Load lock : Slow and fast
Vent type: Venting and diffuser
Load lock pumping type: Fast load lock pumping
Slit valve: Bonded
Wafer detector: Blade cap and vac sensor
Gas / Pressure:
Gas feed: Top
Filters: MILLIPORE / PALL
Pneumatic valves: Nupro / Veriflow
Chamber pressure gauge: MKS 10 Torr
Chamber foreline TC gauge: VARIAN
Gas for chamber A:
Gas / MFC
SiH4 / 500 sccm
N2 / 100 sccm
N2O-H / 3000 sccm
NF3 / 20 sccm
N2O / 300 sccm
Cl2 / 100 sccm
Gas for chamber B:
Gas / MFC
SiH4 / 500 sccm
N2 / 100 sccm
N2O-H / 3000 sccm
NF3 / 20 sccm
N2O / 300 sccm
Cl2 / 100 sccm
Gas for chamber C:
Gas / MFC
O2 / 00 sccm
CF4 / 20 sccm
Ar / 100 sccm
RF Generator and heat exchanger:
ENI OEM-12B RF Generator: Chamber A and B
ENI OEM-6 RF Generator: Chamber D
RF match type: Phase-VI
(2) RF Cable: 50ft
CVD Heat exchanger type: AMAT-1
Heat exchanger signal cable: 32ft
System local monitor: CRT with light pen
Remote control cables (Analog, digital): (2) 50 FT Etchers
Lift assembly
Susceptor lift assembly
Transfer robot
Slit valve cylinder
Wafer lift bellows
Susceptor lift bellows
Robot blade, 8"
Throttle valve (Dual spring type)
Belts in throttle valves
DC Power cable: 50ft
EMO Cable: 50ft
Hard disk in VME Missing
Power supply: 208 V, 50/60 Hz, 250 A / 5-Wires.
AMAT / APPLIED MATERIALS P5000 is a plasma CVD reactor used for surface modification and deposition of a range of material layers. The Plasma CVD technique employed by AMAT P-5000 is a low-pressure process which utilises a mixture of gases that are ionised with the use of a plasma to create the reactions and deposition necessary for surface modification. The vessel through which the process is carried out is built of stainless steel and is double-walled to ensure uniform pressure and temperature control. The chamber is loaded with a component large enough to accommodate various process needs, arranged on an integrated electrode. The interior of the vessel is then sealed and a pump begins to remove air and other gases, creating a vacuum within the sealed vessel. The generation of a plasma is achieved by introducing a mixture of required gases a high speed and at a low pressure, through the part of the vessel. A vacuum is produced using an RF generator and an inductor coil. The mixture of gases is then ionised by the magnetically generated high-energy field. This plasma provides a high concentration of electrons and ions that can break down molecules and react with the component in the vessel. APPLIED MATERIALS P 5000 is well known for its flexibility and robust design, as it can accommodate a variety of component shapes and sizes. Processes achievable with P-5000 include nitriding, etching, and silicon deposition, among others. Additionally, the system can serve as an injector for a variety of doping processes. The versatility of APPLIED MATERIALS P-5000 has made it a workhorse for many research laboratories in industry and academia, and its ability to produce high quality results make it a preferred choice for a multitude of surface modification needs. AMAT P5000 is an efficient, durable and reliable solution for improving material surface and overall performance of components.
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