Used AMAT / APPLIED MATERIALS P5000 #9389400 for sale

ID: 9389400
Wafer Size: 6"
CVD System, 6" SV21 SBC Board Main frame type: Mark-II Cassette indexer, 6" Clamp 8 Slots elevator (2) CRT Monitor Robots: Phase-III Robot blade: Standard vacuum Centerfinder: USE Cap wafer sensor AC Rack: 1 Shrink Heat exchanger EMO Option: Turn to release EMO Button guardrings Status light tower (Color / Position): Red, Yellow, Green, Blue Signal cable: 25' Flash hard disk drive Floppy: 3.5" SCSI Driver Gas panel: 12 Channels standard / Minicontroller RF Generator: Chamber A: OEM12B-07 Chamber B: OEM12B-02 Chamber C: OEM12B-02 Chamber: Chamber position: A, B, D Chamber type: DLH 1-Hole Process: SiH4 Oxide Heater type: Lamp Susceptor type: Al (3) Matchers Delta nitride dual spring throttle valve Gas panel: 20 Standard channels Gas supply: Top down MFC: SEC4400MC Manual valve: NUPRO Pneumatic 2-Way valve: NUPRO MKS 122B Baratron gauge, 10 Torr Gases: Gas / Range N2 / 3 SLM SiH4 / 100 SCCM CF4 / 2 SLM N2O / 2 SLM.
AMAT / APPLIED MATERIALS P5000 is a thin film reactor equipment designed for deposition of thin films on substrates, such as glass or silicon wafers. This reaction chamber is designed to provide advanced control over a range of deposition conditions, from ultra-high to ultra-low vacuum levels, over a wide temperature range (-40 to 650°C). It's located inside a clean room equipped with a sophisticated thermal management system for precise thermal control, enabling it to meet the most demanding thin film processing applications. The unit is designed to provide control over several variables related to the growth of thin films. These variables include pressure, temperature, deposition rate, and growth. AMAT P-5000 reactor uses an ultra-high vacuum deposition chamber which is equipped with gas mixing tools, mass flow controllers, capacitance manometers and an FTIR machine. It also contains linear and rotary sources, such as electron beam evaporators and sputter guns. In addition, the chamber has a roughing pump, a turbomolecular pump, and an ion pump, as well as a liquid nitrogen closed-loop chiller, to create an environment in which the thin film can be grown. APPLIED MATERIALS P 5000 reactor is also equipped with an array of process features which make it suitable for a wide range of thin film processing applications. Features of note include automatic film thickness control, temperature mapping, temperature profiling, uniformity control and real-time process monitoring. These features can be configured to ensure the film's uniformity and stress.\ The automation capabilities of AMAT / APPLIED MATERIALS P 5000 make it suitable for a number of applications. In particular, it has been used to deposit oxides, nitrides, and metals, as well as to etch films and perform passivation and ablation of materials. Furthermore, due to its precision pressure control, it is suitable to use for non-evaporation methods of thin film deposition, such as magnetron sputtering and CVD. Finally, APPLIED MATERIALS P5000 is an easy-to-operate tool with advanced safety features. It is equipped with a gas-leak detector, an emergency shut down asset, and strict monitoring of operation parameters to comply with the most stringent safety regulations.
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