Used AMAT / APPLIED MATERIALS P5000 #9399067 for sale

AMAT / APPLIED MATERIALS P5000
ID: 9399067
Wafer Size: 6"
CVD System, 6".
AMAT / APPLIED MATERIALS P5000 is a multi-chamber, low-volume production reactor designed for semiconductor processing. It is capable of depositing, etching, and cleaning layers of material onto a semiconductor wafer with extremely fine precision and accuracy. AMAT P-5000 consists of a number of different chambers, all of which work together to achieve the desired outcome. APPLIED MATERIALS P 5000 consists of a plasma enhanced chemical vapor deposition (PECVD) chamber, a rapid thermal process (RTP) chamber, and an etch chamber. Each of these chambers contains the necessary tools and components to achieve their respective processes. The PECVD chamber creates layers of material using a plasma gas, which is a gas containing many charged particles and ions. This gas is excited by a high-frequency electrical field in order to heat it up and break it down into a vapor. This vapor is then fed into the reactor chamber in a vacuum where it is used to deposit material onto the substrate. The RTP chamber is used for rapid thermal annealing, or heating and cooling of the substrate in order to initiate a reaction. In this chamber, the substrate is heated and then immediately cooled in order to improve the films deposited by the PECVD chamber. The etch chamber is then used to etch or remove unwanted material from the substrate. The etcher utilizes a combination of gases, including a fluorinated perfluorocarbon (FPC) and a plasma-producing gas, to remove layers of unwanted material. In addition to the chambers, AMAT P5000 also has sophisticated control systems which allow the user to monitor and adjust the processes occurring in the chambers. This includes the ability to adjust the temperature, pressure, and gas flow rate amongst other parameters in order to achieve the optimal result. Overall, P 5000 is a highly advanced and accurate reactor capable of achieving fine levels of precision when creating and etching layers of material onto a substrate. Its many adjustable controls and chambers combine to provide the user with the ultimate tool for depositing, etching, and cleaning semiconductor wafers.
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