Used AMAT / APPLIED MATERIALS P5000 #9409079 for sale

AMAT / APPLIED MATERIALS P5000
ID: 9409079
PECVD System.
AMAT / APPLIED MATERIALS P5000 is a high performance tool which is used for growing thin films on semiconductor substrates. It is a short-arc-plasma, low-pressure-reactor, capable of delivering high purity deposition. AMAT P-5000 is a two stage system, consisting of a plasma source and an ultrahigh vacuum bellows chamber. At the start of the deposition experiment, the glass samples are placed inside the chamber, which is then sealed and evacuated to a pressure of 1 x 10-6 mBar or lower. The source is then activated and a plasma is formed between two electrodes in the source vessel. A stream of the chosen deposition precursor is then introduced into the plasma, and the energetic species molecule fragments that are liberated by the plasma bombard the substrate and the sample surfaces. The plasma used in the Applied Material APPLIED MATERIALS P 5000 is an argon/hydrogen mixture, and the substrate temperatures can range from as low as 200°C to as high as 800°C. The chamber design facilitates uniform deposition throughout the sample. Once the film deposition is completed, the chamber is vented and the samples are removed. The Applied Material P-5000 is ideal for deposition of advanced dielectric materials, suitable for the fabrication of components in the semiconductor integrated circuit industry. Several parameters can be varied to optimize the deposition profile, such as temperature and gas mixture, as well as the deposition rate and film thickness. The instrument is accurate and repeatable, enabling repeatable results over several deposition runs. Overall, AMAT P5000 low-pressure-reactor is a reliable and flexible device that delivers high-quality thin film deposition on semiconductor substrates, with an excellent temperature control. Its high uniformity and precise deposition profile offer reliable and consistent results. The device is ideal for research applications as well as a wide range of manufacturing requirements.
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