Used AMAT / APPLIED MATERIALS P5000W #9132652 for sale

AMAT / APPLIED MATERIALS P5000W
ID: 9132652
Vintage: 1996
LPCVD system (6) Chambers Process: W-PLUG 1996 vintage.
AMAT / APPLIED MATERIALS P5000W is a chemical vapor deposition (CVD) reactor, specifically designed for advanced memory and logic device research and production. The reactor features a quartz chamber with a rugged design for conventional and plasma enhanced CVD (PECVD) capability. The pressure and temperature within the reactor are both precisely controlled, for an optimal processing environment. The equipment is also equipped with nitrogen purge gas capability for advanced process insights. AMAT P5000W comes with an intuitive user interface providing a real-time display of reaction chamber pressure and temperature data. APPLIED MATERIALS P5000W also offers advanced features such as automatic operational metrology, allowing users to perform a variety of routine system checks with minimal effort. This also allows for accurate process reproducibility and repeatability. Inside the advanced CVD reactor there is an in-situ detector for reactive species monitoring as well as in-situ temperature and pressure readouts with a 0.1%, 0.2%, 0.3%, and 0.5% accuracy readings. The unit also incorporates a variety of advanced process control capabilities, including multi-pressure capability and automated setpoint adjustments. P5000W's large chamber design allows for high throughputs due to the extremely low film growth rates that can be achieved. With rapid thermal cyclings, the throughputs of AMAT / APPLIED MATERIALS P5000W can reach more than 1000 wafers per hour. The large chamber capacity also enables the runs of large wafers and non-conventional substrates, such as SOI or sapphire. The reactor is used for many memory and logic device applications such as copper interconnects, tungsten plugging layers, contact cutback, and oxide and nitride passivation layers. It can be used for copper interconnect or tungsten plugging layer processes, with extremely precise temperature, pressure, and process parameter control achievable to a level of <1%. It can also perform a variety of non-conventional CVD processes, including oxide and nitride passivation layers, contact cutback, and contact-less deposition of high aspect ratio trenches. Finally, the reactor has been designed for easy maintenance and cleaning. The chamber and components are easy to access, and the tools necessary are typically supplied with the machine. Also, direct integration with other process tools is available via expansive digital communication capabilities, providing seamless tool control with maximum process optimization.
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