Used AMAT / APPLIED MATERIALS Producer III #149570 for sale
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ID: 149570
Wafer Size: 12"
Vintage: 2002
CVD system, 12"
Process: BPSG
Wafer shape: SNNF
Chamber A: SACVD-TWIN
Chamber B: SACVD-TWIN
Line voltage: 200 / 208 VAC
Line frequency: 60 Hz
Phase: 3 phase
AC P/N: 0180-01905
EMO switch type: turn to release EMO
Smoke detector: no
Chamber A: BPSG
Controllers:
Chamber set interface: yes
SPX MUXADIO110: yes
Chamber set power supply: yes
Chamber set interconnect assembly: yes
GP SPX MUXADIO110: yes
GP interface BD: yes
Other controller:
WATLOW temperature controller: yes
Heater RF filter: yes
EV manifold: yes
Thermocouple: yes
5 phase lift driver UDK5214NW oriental motor: yes
Heater lift assembly:
Heater base: yes
Lead screw assembly: yes
Motor: yes
Heater lift bellows: yes
Lift pin assembly:
Lift pin assembly: yes
Lift ceramic ring: yes
Lift pin bellows: yes
Remote clean: ASTRONex FI80131 RPS
Transformer: JEFFERSON ELECTRIC POWERFORMER outdoor N0101 type 3R U/L, CAT number: 211-0111-120: yes
Fore line assembly:
Throttle valve: yes
Isolation valve: yes
Pirani gauge: yes
Heating jackets: yes
RGA port NW25: yes
Fore lines: yes
Pressure gauge:
MKS 629B13TBC, 1000 torr: yes
MKS 627A-12338, 20 torr: yes
MKS 51A13TCA2BA640 ATM switch: yes
Chamber B: BPSG
Controllers:
Chamber set interface: yes
SPX MUXADIO110: yes
Chamber set power supply: yes
Chamber set interconnect assembly: yes
GP SPX MUXADIO110: yes
GP interface BD: yes
Other controller:
WATLOW temperature controller: yes
Heater RF filter: yes
EV manifold: yes
Thermocouple: yes
5 phase lift driver UDK5214NW oriental motor: yes
Heater lift assembly:
Heater base: yes
Lead screw assembly: yes
Motor: yes
Heater lift bellows: yes
Lift pin assembly:
Lift pin assembly: yes
Lift ceramic ring: yes
Lift pin bellows: yes
Remote clean: ASTRONex FI80131 RPS
Transformer: JEFFERSON ELECTRIC POWERFORMER outdoor N0101 type 3R U/L, CAT number: 211-0111-120: yes
Fore line assembly:
Isolation valve: yes
RGA port NW25: yes
Pressure gauge:
MKS 629B13TBC, 1000 torr: yes
MKS 627A-12338, 20 torr: yes
MKS 51A13TCA2BA640 ATM switch: yes
Gas panel and pallet:
Mainframe type: Producer III 12"
Gas feed (top): yes
System cabinet exhaust (top): yes
MFC: Celerity UFC 8160 metal digital MFC's: yes
LFM:
STEC HORIBA LF-A410A-EVD 7.0: yes
STEC HORIBA LF-A410A-EVD 1.5: yes
STEC HORIBA LF-A310A-EVD 0.5: yes
Injection valve: STEC HORIBA: yes
Valve: FUJIKIN 5 RA max: yes
Filter:
MILLIPORE 5 RA: yes
MYCROLIS O3 GS line: yes
SLD (single line drop): no
SLD valve type: FUJIKIN diaphragm: yes
Veriflo 10 RA regulator: yes
MKS LDMB12PA2CC1 transducer with display: yes
Smoke detector photohelic: yes
Generic facilities / scrubber interface: yes
Facilities interlock indicator: no
Interface output (fault): yes
Display gas pallet: yes
Chamber A gas pallet: SA-BPSG
Liquid 1: TEOS 7.0 G, LF410A-EVD
Liquid 2: TEOS 0.5 G, LF310A-EVD
Liquid 3: TEOS 1.5 G, LF410A-EVD
1: O3
2: O2, 30 slm
3: N2 purge
4: NF3, 5 slm
5: N2, 3 slm
6: AR, 10 slm
7:
8: N2, 30 slm
9: HE, 30 slm
10: N2 purge
Chamber B gas pallet: SA-BPSG
Liquid 1: TEOS 7.0 G, LF410A-EVD
Liquid 2: TEOS 0.5 G, LF310A-EVD
Liquid 3: TEOS 1.5 G, LF410A-EVD
1: O3
2: O2, 30 slm
3: N2 purge
4: NF3, 5 slm
5: N2, 3 slm
6: AR, 10 slm
7:
8: N2, 30 slm
9: HE, 30 slm
10: N2 purge
System placement: stand alone
EV mainfold: yes
System controller:
Facilities UPS interface: yes
MF controllers:
Chamber set interface: yes
SPX MUXADIO110: yes
Maintenance switch: yes
MF DC power supply assembly: yes
VME rack:
1: SBC
15: serial / video
16, 17: HDD
19, 20: FDD
DVD: yes
FDD: yes
Load locks:
Load lock lift assembly:
Motor
Lead screw assembly
Bellows
Lid assembly:
Wafer sliding sensor
Lid cover
Fore line assembly:
Isolation valve
Fore lines
LL door assembly: VAT valve assembly
Slit valve assembly: slit valve with Kalrez seal
Transfer chamber (buffer):
Robot type: VHP dual
Wafer sensing type: wafer pocket sensor
EDWARDS IPX100 pump
Isolation valve
Pirani gauge
RGA port, NW25
Fore lines
Slit valve assembly:
Slit valve with Kalrez seal
Assembly
Signal lamp tower:
Tower locations: front and rear mounted
Lamp colors: red, amber, green blue
Number of lamps per tower: (4)
Fab interface: standard GEM interface
Factory interface:
Front end interface: 12" FI 2 load ports
Path through: yes
Robot type: NEWPORT KENSINGTON POD 1 and 2
Facility: mainframe gas lines
MF N2 regulation: regulated 80 PSI
Remote systems:
HX 300 W/C heat exchanger: yes
HX 300 chiller for ozonator: yes
System monitors:
Monitor type: VGA with light pen, through the wall
2002 vintage.
AMAT / APPLIED MATERIALS Producer III is a reactor equipment designed for semiconductor process research and development. AMAT Producer III delivers high-quality processing results while providing superior process control. It is designed to be simple to set up and maintain, allowing users to quickly transition between processes. APPLIED MATERIALS Producer III is a high-precision system that offers a range of capabilities, making it suitable for applications ranging from epitaxy to nanotechnology. Features include a large temperature range, precision pressure control, multiple stage pumping, and the use of real-time data acquisition. The unit provides high-temperature deposition and etch processing, with temperatures up to 1100°C. This makes it suitable for producing compound semiconductors, such as gallium nitride (GaN) and aluminum gallium arsenide (AlGaAs). Producer III includes a quartz crystal microbalance (QCM) to monitor film thickness with a precision of 0.2nm. This can help to accurately deposit films with thicknesses in the nanometer range. AMAT / APPLIED MATERIALS Producer III also offers a range of advanced process control capabilities, including the ability to monitor process parameters such as temperature, pressure, and total gas flow in real-time. The machine includes an exothermic regulator that monitors the temperature at each level to ensure production is optimized. This helps to ensure repeatable and stable performance on each process cycle. The thermal capabilities of AMAT Producer III are also well-suited for ambient pressure dry etching. This involves the use of RF power to remove material at high temperatures, allowing for precise etch profiles and profiles with no under-etching. The equipment offers a wide range of process options, including the ability to anneal features in a controlled atmosphere and performing selective area etch processing. APPLIED MATERIALS Producer III is a robust tool that offers a range of process capabilities, allowing users to explore a wide range of applications without having to invest in multiple deposition and etch systems. It is ideal for research and semiconductor-grade processing applications, as it offers high precision, repeatability, and offers fast turnaround times.
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