Used AMAT / APPLIED MATERIALS Producer III #149570 for sale

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ID: 149570
Wafer Size: 12"
Vintage: 2002
CVD system, 12" Process: BPSG Wafer shape: SNNF Chamber A: SACVD-TWIN Chamber B: SACVD-TWIN Line voltage: 200 / 208 VAC Line frequency: 60 Hz Phase: 3 phase AC P/N: 0180-01905 EMO switch type: turn to release EMO Smoke detector: no Chamber A: BPSG Controllers: Chamber set interface: yes SPX MUXADIO110: yes Chamber set power supply: yes Chamber set interconnect assembly: yes GP SPX MUXADIO110: yes GP interface BD: yes Other controller: WATLOW temperature controller: yes Heater RF filter: yes EV manifold: yes Thermocouple: yes 5 phase lift driver UDK5214NW oriental motor: yes Heater lift assembly: Heater base: yes Lead screw assembly: yes Motor: yes Heater lift bellows: yes Lift pin assembly: Lift pin assembly: yes Lift ceramic ring: yes Lift pin bellows: yes Remote clean: ASTRONex FI80131 RPS Transformer: JEFFERSON ELECTRIC POWERFORMER outdoor N0101 type 3R U/L, CAT number: 211-0111-120: yes Fore line assembly: Throttle valve: yes Isolation valve: yes Pirani gauge: yes Heating jackets: yes RGA port NW25: yes Fore lines: yes Pressure gauge: MKS 629B13TBC, 1000 torr: yes MKS 627A-12338, 20 torr: yes MKS 51A13TCA2BA640 ATM switch: yes Chamber B: BPSG Controllers: Chamber set interface: yes SPX MUXADIO110: yes Chamber set power supply: yes Chamber set interconnect assembly: yes GP SPX MUXADIO110: yes GP interface BD: yes Other controller: WATLOW temperature controller: yes Heater RF filter: yes EV manifold: yes Thermocouple: yes 5 phase lift driver UDK5214NW oriental motor: yes Heater lift assembly: Heater base: yes Lead screw assembly: yes Motor: yes Heater lift bellows: yes Lift pin assembly: Lift pin assembly: yes Lift ceramic ring: yes Lift pin bellows: yes Remote clean: ASTRONex FI80131 RPS Transformer: JEFFERSON ELECTRIC POWERFORMER outdoor N0101 type 3R U/L, CAT number: 211-0111-120: yes Fore line assembly: Isolation valve: yes RGA port NW25: yes Pressure gauge: MKS 629B13TBC, 1000 torr: yes MKS 627A-12338, 20 torr: yes MKS 51A13TCA2BA640 ATM switch: yes Gas panel and pallet: Mainframe type: Producer III 12" Gas feed (top): yes System cabinet exhaust (top): yes MFC: Celerity UFC 8160 metal digital MFC's: yes LFM: STEC HORIBA LF-A410A-EVD 7.0: yes STEC HORIBA LF-A410A-EVD 1.5: yes STEC HORIBA LF-A310A-EVD 0.5: yes Injection valve: STEC HORIBA: yes Valve: FUJIKIN 5 RA max: yes Filter: MILLIPORE 5 RA: yes MYCROLIS O3 GS line: yes SLD (single line drop): no SLD valve type: FUJIKIN diaphragm: yes Veriflo 10 RA regulator: yes MKS LDMB12PA2CC1 transducer with display: yes Smoke detector photohelic: yes Generic facilities / scrubber interface: yes Facilities interlock indicator: no Interface output (fault): yes Display gas pallet: yes Chamber A gas pallet: SA-BPSG Liquid 1: TEOS 7.0 G, LF410A-EVD Liquid 2: TEOS 0.5 G, LF310A-EVD Liquid 3: TEOS 1.5 G, LF410A-EVD 1: O3 2: O2, 30 slm 3: N2 purge 4: NF3, 5 slm 5: N2, 3 slm 6: AR, 10 slm 7: 8: N2, 30 slm 9: HE, 30 slm 10: N2 purge Chamber B gas pallet: SA-BPSG Liquid 1: TEOS 7.0 G, LF410A-EVD Liquid 2: TEOS 0.5 G, LF310A-EVD Liquid 3: TEOS 1.5 G, LF410A-EVD 1: O3 2: O2, 30 slm 3: N2 purge 4: NF3, 5 slm 5: N2, 3 slm 6: AR, 10 slm 7: 8: N2, 30 slm 9: HE, 30 slm 10: N2 purge System placement: stand alone EV mainfold: yes System controller: Facilities UPS interface: yes MF controllers: Chamber set interface: yes SPX MUXADIO110: yes Maintenance switch: yes MF DC power supply assembly: yes VME rack: 1: SBC 15: serial / video 16, 17: HDD 19, 20: FDD DVD: yes FDD: yes Load locks: Load lock lift assembly: Motor Lead screw assembly Bellows Lid assembly: Wafer sliding sensor Lid cover Fore line assembly: Isolation valve Fore lines LL door assembly: VAT valve assembly Slit valve assembly: slit valve with Kalrez seal Transfer chamber (buffer): Robot type: VHP dual Wafer sensing type: wafer pocket sensor EDWARDS IPX100 pump Isolation valve Pirani gauge RGA port, NW25 Fore lines Slit valve assembly: Slit valve with Kalrez seal Assembly Signal lamp tower: Tower locations: front and rear mounted Lamp colors: red, amber, green blue Number of lamps per tower: (4) Fab interface: standard GEM interface Factory interface: Front end interface: 12" FI 2 load ports Path through: yes Robot type: NEWPORT KENSINGTON POD 1 and 2 Facility: mainframe gas lines MF N2 regulation: regulated 80 PSI Remote systems: HX 300 W/C heat exchanger: yes HX 300 chiller for ozonator: yes System monitors: Monitor type: VGA with light pen, through the wall 2002 vintage.
AMAT / APPLIED MATERIALS Producer III is a reactor equipment designed for semiconductor process research and development. AMAT Producer III delivers high-quality processing results while providing superior process control. It is designed to be simple to set up and maintain, allowing users to quickly transition between processes. APPLIED MATERIALS Producer III is a high-precision system that offers a range of capabilities, making it suitable for applications ranging from epitaxy to nanotechnology. Features include a large temperature range, precision pressure control, multiple stage pumping, and the use of real-time data acquisition. The unit provides high-temperature deposition and etch processing, with temperatures up to 1100°C. This makes it suitable for producing compound semiconductors, such as gallium nitride (GaN) and aluminum gallium arsenide (AlGaAs). Producer III includes a quartz crystal microbalance (QCM) to monitor film thickness with a precision of 0.2nm. This can help to accurately deposit films with thicknesses in the nanometer range. AMAT / APPLIED MATERIALS Producer III also offers a range of advanced process control capabilities, including the ability to monitor process parameters such as temperature, pressure, and total gas flow in real-time. The machine includes an exothermic regulator that monitors the temperature at each level to ensure production is optimized. This helps to ensure repeatable and stable performance on each process cycle. The thermal capabilities of AMAT Producer III are also well-suited for ambient pressure dry etching. This involves the use of RF power to remove material at high temperatures, allowing for precise etch profiles and profiles with no under-etching. The equipment offers a wide range of process options, including the ability to anneal features in a controlled atmosphere and performing selective area etch processing. APPLIED MATERIALS Producer III is a robust tool that offers a range of process capabilities, allowing users to explore a wide range of applications without having to invest in multiple deposition and etch systems. It is ideal for research and semiconductor-grade processing applications, as it offers high precision, repeatability, and offers fast turnaround times.
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