Used AMAT / APPLIED MATERIALS Producer S #9003816 for sale

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ID: 9003816
System, 12" Chamber A Twin BPSG Chamber B Twin BPSG Chamber C Twin BPSG Wafer shape: SNNF SMIF interface: no Chamber A: Frequency: None Manometer: 20/1000 Torr Clean type (rpc): Astex Dpa: No Chamber B: Frequency: None Manometer: 20/1000 Torr Clean type (rpc): Astex Dpa: No Chamber C: Frequency: None Manometer: 20/1000 Torr Clean type (rpc): Astex Dpa: No Electrical requirements: Line Frequency: 60 Hz Line Voltage: 200/208 V Line Amperage: 240 A Facility ups interface : Yes System monitor: 1st Monitor: Through the wall 2nd Monitor: Standalone 3rd Monitor: None Mainframe: Mainframe Type: Shrinkage Robot Type: VHP dual Loadlock Cassette: Manual 2 cassette SMIF: No SMIF Robot: NA Ozone generator: Chamber A: AX8400 Chamber B: AX8406B Chamber C: AX8406B Dry pumps: Chamber A: - Chamber B: - Chamber C: - Loadlock: IPX100 VME rack: SBC: Yes VGA: Yes MEI #1: Yes MEI #2: Yes I/O EXPAN.: Yes Monitor Select: Yes Floppy: Yes HDD: Yes Gas delivery: MFC Type: STEC 410A (LFM), Unit C8161 Valves: Fujikin 5 Ra max Filters: Millipore Transducers: MKS without display Regulators: Parker Single Line Drop (SLD): No SLD Gas Lines Feed: Top feed System Cabinet Exhaust: Top Gas pallet configuration: CH.A SIZE MODEL O2 30 SLM UFC 8161 NF3 5 SLM UFC 8161 AR 5 SLM UFC 8161 HE 30 SLM UFC 8161 N2 30 SLM UFC 8161 TEOS 7000 LF-410A-EVD TEB 1500 LF-310A-EVD TEPO 500 LF-310A-EVD CH.B SIZE MODEL O2 30 SLM UFC 8161 NF3 5 SLM UFC 8161 AR 5 SLM UFC 8161 HE 30 SLM UFC 8161 N2 30 SLM UFC 8161 TEOS 7000 LF-410A-EVD TEB 1500 LF-310A-EVD TEPO 500 LF-310A-EVD CH.C SIZE MODEL O2 30 SLM UFC 8161 NF3 5 SLM UFC 8161 AR 5 SLM UFC 8161 HE 30 SLM UFC 8161 N2 30 SLM UFC 8161 TEOS 7000 LF-410A-EVD TEB 1500 LF-310A-EVD TEPO 500 LF-310A-EVD Includes: (2) Ceramic Heater (2) Ceramic Heater (2) Ceramic Heater Buffer Chamber, Chamber A EFEM (3) Cermic Liner, NF3 Gas Line (1) Signal Cable, Exhase flange, Photo helic Monitor Panel (2) RPS Ass'y (2) RPS Ass'y (2) RPS Ass'y Load Lock Pump (6) AL Pumping Ring, Ceramic Pumping Ring Monitor Monitor Chamber B Chamber C Temp Controller (6) AL Shower Head, AL Blocker Plate (6) AL Lid Ass'y (6) Ceramic Pumping Ring (3) AL Lid Block (6) Top Ceramic Ring Ch C Foreline, Mux Controller Producer M,RF AC O3 Cabinet AC Rack A-Chamber Cover B-Chamber Cover 2001 vintage.
AMAT / APPLIED MATERIALS Producer S is an industrial-grade chemical vapor deposition (CVD) reactor. It is designed to deposit high-performance thin films on wafers/substrates with diameters up to 200 mm. It is composed of an enclosed chamber and an array of process sources that precursors react in a nonthermal atmospheric pressure plasma. This plasma, created by radio frequency-ADT (Atmospheric Direct-current) technology, enhances the surface interactions by breaking down the precursors into smaller fragments which can be more evenly distributed over the surface of the wafer. The plasma is also essential in providing a uniform process temperature, which is necessary for high-quality film deposition in CVD. The process source also includes high-frequency halogen lamps and quartz heating elements to ensure uniform temperature distributions over the interior of the chamber. The uniform temperature distribution ensures reliability and reproducibility in the production of thin films. This is especially important in fields such as in semiconductor and nanotechnology applications where high film quality is needed. In addition to its uniform temperatures and its reliable and reproducible thin-film depositions, AMAT PRODUCERS has other advantages. For example, the heat source of the plasma can be changed without interrupting the process, allowing for high throughput with minimal heat effects on the wafer. It also has a rapid cycle time of up to 30 minutes, high wafer loading capacity of 30 wafers, and a low-cost of ownership. Finally, APPLIED MATERIALS PRODUCER-S is equipped with intuitive graphical user interface (GUI), making it easy and user-friendly to operate and maintain. This GUI is also optimized with efficient recipes to achieve success in various application fields and a monitoring system for hardware and process parameters such as vacuum level and deposition rate.
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