Used AMAT / APPLIED MATERIALS Producer S #9003816 for sale
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ID: 9003816
System, 12"
Chamber A Twin BPSG
Chamber B Twin BPSG
Chamber C Twin BPSG
Wafer shape: SNNF
SMIF interface: no
Chamber A:
Frequency: None
Manometer: 20/1000 Torr
Clean type (rpc): Astex
Dpa: No
Chamber B:
Frequency: None
Manometer: 20/1000 Torr
Clean type (rpc): Astex
Dpa: No
Chamber C:
Frequency: None
Manometer: 20/1000 Torr
Clean type (rpc): Astex
Dpa: No
Electrical requirements:
Line Frequency: 60 Hz
Line Voltage: 200/208 V
Line Amperage: 240 A
Facility ups interface : Yes
System monitor:
1st Monitor: Through the wall
2nd Monitor: Standalone
3rd Monitor: None
Mainframe:
Mainframe Type: Shrinkage
Robot Type: VHP dual
Loadlock Cassette: Manual 2 cassette
SMIF: No
SMIF Robot: NA
Ozone generator:
Chamber A: AX8400
Chamber B: AX8406B
Chamber C: AX8406B
Dry pumps:
Chamber A: -
Chamber B: -
Chamber C: -
Loadlock: IPX100
VME rack:
SBC: Yes
VGA: Yes
MEI #1: Yes
MEI #2: Yes
I/O EXPAN.: Yes
Monitor Select: Yes
Floppy: Yes
HDD: Yes
Gas delivery:
MFC Type: STEC 410A (LFM), Unit C8161
Valves: Fujikin 5 Ra max
Filters: Millipore
Transducers: MKS without display
Regulators: Parker
Single Line Drop (SLD): No
SLD Gas Lines Feed: Top feed
System Cabinet Exhaust: Top
Gas pallet configuration:
CH.A SIZE MODEL
O2 30 SLM UFC 8161
NF3 5 SLM UFC 8161
AR 5 SLM UFC 8161
HE 30 SLM UFC 8161
N2 30 SLM UFC 8161
TEOS 7000 LF-410A-EVD
TEB 1500 LF-310A-EVD
TEPO 500 LF-310A-EVD
CH.B SIZE MODEL
O2 30 SLM UFC 8161
NF3 5 SLM UFC 8161
AR 5 SLM UFC 8161
HE 30 SLM UFC 8161
N2 30 SLM UFC 8161
TEOS 7000 LF-410A-EVD
TEB 1500 LF-310A-EVD
TEPO 500 LF-310A-EVD
CH.C SIZE MODEL
O2 30 SLM UFC 8161
NF3 5 SLM UFC 8161
AR 5 SLM UFC 8161
HE 30 SLM UFC 8161
N2 30 SLM UFC 8161
TEOS 7000 LF-410A-EVD
TEB 1500 LF-310A-EVD
TEPO 500 LF-310A-EVD
Includes:
(2) Ceramic Heater
(2) Ceramic Heater
(2) Ceramic Heater
Buffer Chamber, Chamber A
EFEM
(3) Cermic Liner, NF3 Gas Line
(1) Signal Cable, Exhase flange, Photo helic
Monitor Panel
(2) RPS Ass'y
(2) RPS Ass'y
(2) RPS Ass'y
Load Lock Pump
(6) AL Pumping Ring, Ceramic Pumping Ring
Monitor
Monitor
Chamber B
Chamber C
Temp Controller
(6) AL Shower Head, AL Blocker Plate
(6) AL Lid Ass'y
(6) Ceramic Pumping Ring
(3) AL Lid Block
(6) Top Ceramic Ring
Ch C Foreline, Mux Controller
Producer M,RF AC
O3 Cabinet
AC Rack
A-Chamber Cover
B-Chamber Cover
2001 vintage.
AMAT / APPLIED MATERIALS Producer S is an industrial-grade chemical vapor deposition (CVD) reactor. It is designed to deposit high-performance thin films on wafers/substrates with diameters up to 200 mm. It is composed of an enclosed chamber and an array of process sources that precursors react in a nonthermal atmospheric pressure plasma. This plasma, created by radio frequency-ADT (Atmospheric Direct-current) technology, enhances the surface interactions by breaking down the precursors into smaller fragments which can be more evenly distributed over the surface of the wafer. The plasma is also essential in providing a uniform process temperature, which is necessary for high-quality film deposition in CVD. The process source also includes high-frequency halogen lamps and quartz heating elements to ensure uniform temperature distributions over the interior of the chamber. The uniform temperature distribution ensures reliability and reproducibility in the production of thin films. This is especially important in fields such as in semiconductor and nanotechnology applications where high film quality is needed. In addition to its uniform temperatures and its reliable and reproducible thin-film depositions, AMAT PRODUCERS has other advantages. For example, the heat source of the plasma can be changed without interrupting the process, allowing for high throughput with minimal heat effects on the wafer. It also has a rapid cycle time of up to 30 minutes, high wafer loading capacity of 30 wafers, and a low-cost of ownership. Finally, APPLIED MATERIALS PRODUCER-S is equipped with intuitive graphical user interface (GUI), making it easy and user-friendly to operate and maintain. This GUI is also optimized with efficient recipes to achieve success in various application fields and a monitoring system for hardware and process parameters such as vacuum level and deposition rate.
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