Used AMAT / APPLIED MATERIALS Producer SE BD/BLOk Low k Dielectric #9287956 for sale

AMAT / APPLIED MATERIALS Producer SE BD/BLOk Low k Dielectric
ID: 9287956
Wafer Size: 12"
PECVD Systems, 12".
AMAT Producer SE BD/BLOk Low k Dielectric is a type of reactor designed to produce thin-film layers in semiconductor device fabrication. This dielectric layer is essential for controlling device characteristics like capacitance, resistance and breakdown voltage of a semiconductor device. APPLIED MATERIALS Producer SE BD/BLOk Low k Dielectric reactor is designed to produce uniform and reproducible dielectric layers via atomic layer deposition (ALD). ALD involves the sequential exposure of a substrate to two or more precursors (chemical species) which react with one another on the substrate to form a thin uniform layer. The reactor is comprised of a heated substrate table enclosed in a quartz chamber and surrounded by around six shower heads. The shower heads are used to precisely deliver various gaseous precursors into the chamber which are then adsorbed onto the substrate. The substrate table can be heated to temperatures ranging from 25°C to 350°C. A high-vacuum pump and pressure gauge are used to monitor and maintain the pressure within the chamber during processing. To ensure uniform coverage of the substrate, the shower heads are designed to deliver a constant distribution of precursor molecules onto the substrate. The gas distribution system is a critical element of the reactor, as a uniform distribution of the precursor molecules permits the formake an interfaceproduction of a thin uniform dielectric films. AMAT / APPLIED MATERIALS Producer SE BD/BLOk Low k Dielectric reactor is designed to produce low-k dielectric layers that can handle low-k stresses due to their low dielectric constant value, allowing for smaller device characteristics while still providing good insulation. This is achieved thanks to its efficient design and use of state-of-the-art technology. AMAT Producer SE BD/BLOk Low k Dielectric reactor is a reliable, cost-effective way to produce thin-film layers in semiconductor device fabrication. Its efficient design allows for improved device characteristics like capacitance, resistance and breakdown voltage, giving manufacturers the ability to produce reliable semiconductor devices.
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