Used AMAT / APPLIED MATERIALS Producer SE #9361863 for sale

AMAT / APPLIED MATERIALS Producer SE is an advanced semiconductor reactor designed to provide maximum etch rate, uniformity, and flexibility. It is ideal for high-throughput applications in the mass production of semiconductor wafers. At the core of AMAT Producer SE is its Enhanced Temperature Control (ETC) equipment which is optimized for high throughput with 4 processing chambers: deposition, etch, ashing, and cooling. This system is capable of providing precise temperature control and maintaining the optimal thermal profile for each individual chamber. The PECVD (plasma-enhanced chemical-vapor deposition) unit is used for the deposition process in APPLIED MATERIALS Producer SE. This utilizes a radio-frequency driven plasma to deposit a uniform layer of material at high rates of speed, utilizing the electron bombardment of a gas mixture in a vacuum. This can include materials such as silicon nitride, silicon dioxide, low-k or high-k dielectrics. The dry etch chamber of Producer SE is where the etching of the material takes place. It is optimized for high-throughput applications and utilizes an inductively coupled plasma (ICP) which is driven by high-power radio-frequency. This allows for a precise and uniform etch process with minimum loading effects and minimal particle contamination. The etching process can also include the utilization of a 400W ICP etch reactor with multiple thresholds to allow for different etch processes on highly complex 3D structures. Following the deposition of processed materials, the ashing process takes place in AMAT / APPLIED MATERIALS Producer SE. This involves the high-temperature removal of deposited layers and can reach temperatures of up to 1000°C. This helps to ensure clean films and efficient re-growths of thin films for further processing. Finally, the cooling chamber of AMAT Producer SE is designed to cool the wafer quickly but carefully. This cooling step is important as the thermal profile of the wafer affects the process outcomes. This is optimized for maximum cooling in minimal time and is designed to reduce thermal stress and increase wafer yields and performance. Ultimately, APPLIED MATERIALS Producer SE is an advanced semiconductor reactor designed to provide maximum etch rate, uniformity and flexibility. Its enhanced temperature control machine and its optimized deposition, etch, ashing, and cooling chambers provide the maximum throughput for complex 3D structures whilst minimizing particle contamination and maintaining thermal profiles for optimal performance.