Used AMAT / APPLIED MATERIALS PVD Chamber for Endura #293705581 for sale

AMAT / APPLIED MATERIALS PVD Chamber for Endura is a type of PVD (Physical Vapor Deposition) reactor used in semiconductor fabrication processes. This chamber is specialized for depositing thin films onto the surfaces of semiconductor wafers or other substrates. AMAT PVD Chamber for Endura is a type of cluster tool reactor designed to be compatible with AMAT Endura platform. It is engineered and optimized to provide superior deposition performance for a range of deposition materials, such as Titanium Nitride (TiN), Copper (Cu), Tungsten (W), and others. The reactor is suitable for a wide range of processes, from low temperature depositions with small pressure ranges for highly uniform films to high temperature processes requiring higher pressure levels for greater stress control. It is capable of handling wafers up to 200mm, including SOI (Silicon on Insulator) and DUV (Deep UV) applications. APPLIED MATERIALS PVD Chamber for Endura reactor utilizes a four-pocket circular, or annular, source geometry. This design is intended to maximize both wafer-to-source uniformity and the utilization of higher-deposition powers. The four-pocket circular geometry also ensures consistent wafer temperature within the deposition area across the wafer. This is achieved by equalizing the gas flow around the wafer edge, providing stability and accuracy across the wafer surface. The annular design also helps reduce backstreaming of the process gases, leading to superior gas uniformit. PVD Chamber for Endura reactor is installed with a number of advanced safety features, including overcurrent protection and a mechanical vacuum pump isolation valve that can be manually opened and shut off as needed. Additionally, the reactor is programmable to perform a number of functions such as recipe switching, wafer baking, substrate heating, and wafer cooling. The unit also features a high-resolution LCD monitor that can provide information on the process conditions and performance in real-time. In terms of process capabilities, AMAT / APPLIED MATERIALS PVD Chamber for Endura can handle deposition temperatures of up to 890°C and pressures up to 10 mbar, making it suitable for depositing films with superior stress control and step coverage. It is engineered to operate with a range of deposition materials, including titanium nitride, copper, tungsten, platinum, chrome, gold, and aluminum. Additionally, the reactor can accommodate up to 21 different gases in order to provide flexibility for a wide range of processes. Overall, AMAT PVD Chamber for Endura is a high-performance, cluster tool reactor designed for the Endura platform. Its unique four-pocket annular source design results in excellent wafer-to-source uniformity and higher deposition powers, making it suitable for a variety of processes. Additionally, its advanced safety features, programmable process capabilities, and wide range of deposition materials make it an ideal deposition system for semiconductor fabrication.