Used AMAT / APPLIED MATERIALS PVD Chamber for Endura #9275254 for sale

AMAT / APPLIED MATERIALS PVD Chamber for Endura is a specialized type of reactor designed for physical vapor deposition (PVD). This reactor utilizes difficult-to-source precursor materials to deposit various films on numerous substrates, including metals, plastics, ceramics, and glass. AMAT PVD Chamber for Endura is a high-performance tool for depositing films in a thin, uniform layer. It features a two-zone design, which allows the user to control the temperature of the substrate and the surrounding atmosphere in order to optimize the deposition process. This allows for precise film thickness control which is essential for many PVD applications. The chamber includes a high-vacuum environment that enables a reaction temperature of up to 650°C. This chamber also features a unique low-gas pressure capability that minimizes contamination risks. Its large deposition area in combination with its temperature and pressure control enable enhanced uniformly of the film structure. Furthermore, the PVD Chamber utilizes a custom-made gas panel that allows for the introduction of reactive gasses essential for the deposition. Additionally, this panel can control the mixture of both inert and reactive gasses in the reaction chamber. APPLIED MATERIALS PVD Chamber for Endura provides process control and understanding that enable cutting-edge device performance. This chamber also enables the use of a wide range of materials and process conditions for applications in the power device, memory device, and optoelectronic device industries. PVD Chamber for Endura is the ideal tool for advanced PVD applications, allowing for the deposition of thin films that require precise deposition parameters and temperature control. This chamber combines the advantages of precision, uniformity, and surface integrity with the robustness of its unique design.