Used AMAT / APPLIED MATERIALS PVD Chamber for Endura #9275263 for sale
URL successfully copied!
ID: 9275263
Wafer Size: 12"
12"
Process: ESIP
Magnet
Cryo pump OB-IF8
Gate valve: VAT
Adaptor: 0040-99333; 0040-99334
Manometer: 1350-00255
ATM gauge: W117V-3H-F12M-X30014
Hot ion / Pirani gauge: 0190-26769
Capacitance pirani gauge: 3310-00073
Pedestal integration box: 0010-28071
SAC CP 10 block board: AS0084-03
Shutter sensor assembly: 0190-10801
Source assembly: 0010-32845
ISO valve: AVT-150M-P-03
Defective power supply: 0190-34624
Heater lift motor
Shutter motor: PK564AW2-A8
Wafer lift motor: MQMA012AF.
Drivers:
Heater driver: 3096-1007
Wafer lift driver: 0190-15328
Pedestal driver: PV2A015SMT 1PA0-C1
Magnet rotation driver: BXD400B-S
5-Phase driver: A346-043-A4
MFC:
AR 50
AR 200
No heater
No matcher.
AMAT PVD Endura Reactor is a state-of-the-art Physical Vapor Deposition (PVD) chamber used to deposit high-quality, specialized metal and other thin films. This chamber consists of a stainless steel cylindrical reaction volume, equipped with feed-throughs for power and RF coupling. It is designed to handle multiple wafers, typically up to 6" - 8" diameter, in a single process run. The chamber can be equipped with a variety of materials source options, including sputtering, evaporation, and magnetron sources. The reaction volume is connected to the control side of the chamber, which houses the power supplies, pre- and post-process process monitoring, such as material sensors, and vacuum pumps and gauges. A computer is integrated in the system to allow for automatic frequency and power tuning during the deposition cycle. The chambers have a temperature range between 5-350 Celsius and can be pressurized to 1.8 millibar. The PVD reaction is maintained and exhausted in the chamber via a two-stage scroll vacuum pump system that maintains the temperature and pressure within the chamber, allowing for better control of the deposition process. The chamber is also equipped with quality control checks, such as gas particle detection, to ensure the quality and accuracy of the deposits. The chamber is powered by a high frequency RF power supply, capable of delivering up to 500 watts of power to the wafer surface. The chamber can also be operated in a pulse mode, allowing pulsed deposition of more complex films. It is also capable of producing thin films with precise thickness and uniformity across large areas. The Endura Reactor is a powerful tool for the deposition of a variety of advanced materials, such as ceramics, nitrides, alloys, metals, and polymers. Its versatile design accommodates a large range of substrate sizes without sacrificing performance, allowing for complex layers to be consistently deposited across multiple wafers. The Endura Reactor's wide set of capabilities, such as precise thickness control and uniformity, makes it one of the most advanced PVD chambers on the market.
There are no reviews yet