Used AMAT / APPLIED MATERIALS PVD Chamber for Endura #9275288 for sale

AMAT / APPLIED MATERIALS PVD Chamber for Endura
ID: 9275288
Wafer Size: 12"
12" Process: RFxT Cu Magnet Heater: 0010-27983 Cryo pump OB-IF8 Gate valve: VAT Angle vacuum valve: AVT-150M-P-03 Adaptor: 0041-06142; 0041-25104 Manometer: 1350-00255 ATM gauge: W117V-3H-F12M-X30014 Capacitance pirani gauge: PCG55003310-00288 Pedestal integration box: 0010-28071 Hot ion / Pirani gauge: 0190-26769 Shutter sensor assembly: 0190-10801 Source assembly: 0010-44917 ISAC CP 10 Block board: AS0084-03 Angle vacuum valve: AVT-150M-P-03 Defective power supply: 0190-34624 Heater lift motor Wafer lift motor: MQMA012AF Shutter motor: PK564AW2-A8 Drivers: Heater driver: 3096-1007 Wafer lift driver: 0190-15328 Pedestal driver: PV2A015SMT1PA0-C1 Magnet rotation driver: BXD400B-S 5-Phase driver: A346-043-A4 MFC: AR 20 AR 20 AR 200 No Cryo pump.
AMAT (APPLIED MATERIALS) AMAT / APPLIED MATERIALS PVD Chamber for Endura is a high-performance physical vapor deposition (PVD) reactor designed to meet the stringent requirements of the semiconductor industry. This modular platform provides a range of thermal, chemical, and physical process capabilities for a variety of applications. The chamber features a robust design that offers a wide process window for a wide range of metal deposition and materials processing needs. It can accommodate up to four process modules, allowing users to quickly reconfigure and adjust the layout to accommodate new technology or applications. The chamber's modular construction and reconfigurable layout enable the end user to adapt quickly to process changes, enabling faster technology transitions. The PVD chamber is powered by a wide range of process gases, in both wet and dry deposition, and features automatic regulation valves and mass flow controllers. Endura has also been designed with advanced cooling systems to maximize thermal uniformity across the entire process module, eliminating hot spots and ensuring superior layer deposition. The PVD chamber is capable of depositing a wide range of metals and materials, such as copper, tungsten, aluminum, and titanium. It also offers a number of unique process capabilities, such as high rate sputter deposition, for depositing high quality coatings on advanced substrates. The chamber also features programmable options for varying the cathode diameter and target speed to achieve complex shape deposition profiles and thin film characteristics. The chamber itself is surrounded by an electronic cabinet housed in an environmental grade insulated Polyurethane panel, ensuring minimal environmental impact. The controllers in the cabinet are linked to the XPS systems, allowing pressure, temperature, and process parameters to be automatically regulated and monitored. Additionally, the chamber is operated through a user-friendly touch panel that enables users to easily manage parameters, track recipes, and monitor the chamber systems. Overall, AMAT PVD Chamber for Endura is an ideal choice for semiconductor production, featuring a flexible design, powerful process capabilities, and ease of operation. Whether you're depositing a wide array of metals and materials, or looking for more complex process features, APPLIED MATERIALS PVD Chamber for Endura delivers a reliable and powerful solution for your production needs.
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