Used AMAT / APPLIED MATERIALS PVD Chamber for Endura #9275291 for sale

AMAT / APPLIED MATERIALS PVD Chamber for Endura
ID: 9275291
Wafer Size: 12"
12" Process: RFxT Cu Magnet Heater: 0010-42030 SMITOMO Cryo pump Gate valve: VAT Angle vacuum valve: AVT-150M-P-03 Adaptor: 0041-06142; 0041-25104 Manometer: 1350-00255 ATM gauge: W117V-3H-F12M-X30014 Capacitance pirani gauge: PCG55003310-00288 Pedestal integration box: 0010-28071 Hot ion / Pirani gauge: 0190-26769 Shutter sensor assembly: 0190-10801 Source assembly: 010-41423 ISAC CP 10 Block board: AS0084-03 Angle vacuum valve: AVT-150M-P-03 Defective power supply: 0190-34624 Heater lift motor Wafer lift motor: MQMA012AF Shutter motor: PK564AW2-A8 Drivers: Heater driver: 3096-1007 Wafer lift driver: 0190-15328 Pedestal driver: PV2A015SMT1PA0-C1 Magnet rotation driver: BXD400B-S 5-Phase driver: A346-043-A4 MFC: AR 20 AR 20 AR 200.
AMAT / APPLIED MATERIALS PVD Chamber for Endura is a physical vapor deposition (PVD) reactor specifically designed for semiconductor processing. It is a cost-effective, reliable, and flexible inline equipment that is capable of providing high-performance deposition processes for a variety of devices, including advanced logic and memory products. The Endura's PVD chamber is equipped with an automated robotic loader providing the highest throughput with precision alignment and on-the-fly wafer handling. The chamber is designed to provide excellent process stability through rigorous process control and repeatability. Advanced robotic technology enables high-precision adjustment of the PVD process parameters to minimize defects and provide high-quality epitaxial films. The Endura PVD chamber provides uniform, clean coverage with uniformity manipulation of a wide range of gases and is compatible with a variety of materials, including aluminum, copper, tungsten, and particularly aluminum content in silicon germanium (SiGe). The Endura PVD chamber utilizes high-density plasma for deposition of highly conformal and defect-free thin film layers. The chamber can be incorporated with an atmospheric and vacuum gate system for simultaneous deposition and etch. The chamber is thermally insulated, so heat transfer is consistent and minimal, ensuring temperature stability across the chamber and across wafers. The Endura PVD chamber features a uniform gas distribution (UGD) unit to control the gas flow and the rate of growth per wafer for uniform coverage. The Endura PVD chamber features a programmable optical machine, allowing for a wide range of optical configuration options with automated alignment and calibration. The Endura PVD chamber is designed with low maintenance requirements and is designed to improve visibility into the process, enabling better on-the-fly adjustment of the process to optimize yield and explore new process possibilities. In addition, the Endura PVD chamber offers high-throughput within a compact footprint.
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