Used AMAT / APPLIED MATERIALS RTP #9225694 for sale

AMAT Reactor Technology Platform (AMAT / APPLIED MATERIALS RTP) is the world's leading platform for process development and production of engineered semiconductor materials. In the semiconductor industry, AMAT RTP is used to drive device miniaturization and increase process speeds by reducing cycle times in wafer fabrication. It is a production-ready platform integrating low-cost, high-performance advanced deposition processes for developing and optimizing engineered material recipes at elevated temperatures and pressure. The environment delivered by APPLIED MATERIALS RTP platform is essential for producing the critical wafer elements—such as features and contacts—required by the modern semiconductor designs. RTP has an advanced deposition chamber featuring innovative technologies that enable the deposition of engineered materials with improved property control. This deposition chamber features an advanced process control and diagnostic system that is capable of rapid development of recipes at elevated temperatures and pressures, as well as precise control of material properties. It also feature precise temperature control and precise and accurate control of material composition. The process control system further enables a wide range of conformal and non-conformal engineered material deposition strategies, enabling the production of highly complex features used in modern semiconductor designs. AMAT / APPLIED MATERIALS RTP platform is also designed to maximize flexibility for process development, providing efficient scheduling, traceable product history and product access across multiple geographies. This allows for the development of complex materials products across a variety of processes while minimizing downtime. It also offers the ability to analyze data and evaluate products with no compromiseto uniformity. The process chamber of AMAT RTP also includes a host of advanced inert-gas injection systems such as a multi-stream gas injector, N2, and H2 generation systems, ozone and oxygen injection, as well as active nitrogen down-bonding and crystal rotation ability. These features enable wafer fabrication processes such as rapid thermal processing, low-pressure chemical vapor deposition, rapid epitaxy and electrochemical deposition to be performed within the same environment. This chamber is further designed to optimize reaction zone performance and ensure high-temperature stability during the deposition process. In summary, APPLIED MATERIALS RTP is an advanced, production-ready platform that integrates the best of modern technologies to produce critical features used in complex semiconductor designs for device miniaturization and increased efficiency. The platform can be used to develop engineered materials recipes at elevated temperatures and pressures, offering precise control of material composition and properties and efficient scheduling of processes. It is designed to provide a comprehensive environment, enabling the efficient and reliable production of complex materials products across the entire semiconductor process.