Used AMAT / APPLIED MATERIALS Siconi R2 #9375625 for sale

AMAT / APPLIED MATERIALS Siconi R2
ID: 9375625
CVD System.
AMAT / APPLIED MATERIALS Siconi R2 reactor is a CVD (chemical vapor deposition) furnace that is used to create thin films over substrates such as semiconductor wafers and other thin-film devices. AMAT Siconi R2 is designed to provide reliable and repeatable deposition results with precise film thickness, uniformity and compositional accuracy. The furnace is temperature-controlled and features a quartz hearth designed to support and maintain temperature uniformity of +/-3 °C throughout the wafer plane while providing uniform deposition as well as excellent film crystallinity, index of refraction, and dielectric constants. It also includes a dual exhaust system that enables better temperature and pressure control and allows improved deposition uniformity. APPLIED MATERIALS Siconi R2 also features a low-temperature bottomless gas panel that allows for quick flow cell exchange and the ability to use multiple reagents. The reactor also supports low-pressure bow-tie and slit injectors, gas mixing cells, and pre- and post-heating for improved film properties. In addition to its deposition capabilities, Siconi R2 includes process analysis and monitoring to ensure high-quality results are achieved. The reactor is equipped with real-time/end of run monitoring, which includes in-situ system diagnostics to detect issues with the process. It also includes an onboard system that enables performance data to be collected, stored, and analyzed to create an automated process audit trail and to improve the reliability and repeatability of the CVD processes. AMAT / APPLIED MATERIALS Siconi R2 also supports a wide range of wafer substrates, including monocrystalline, non-crystalline, compound, and oxide materials, making it ideal for a variety of applications, including memory and logic device fabrication, nanostructures, and high-k dielectric layers. Overall, AMAT Siconi R2 provides reliable and repeatable CVD deposition with precise film thickness and uniformity, enabling high-quality results for many different types of processes. The reactor includes numerous features that enable improved process performance and monitoring, making it a versatile and reliable choice for thin-film deposition applications.
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