Used AMAT / APPLIED MATERIALS Smartweb SL-3L/800 #293745938 for sale
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ID: 293745938
Vintage: 2018
Roll to roll coating system
(2) Chillers
Roughing pump system
Process and rewinding module
Media supply
Electrical cabinet
Cooling
Heating
Trolley
Cathode colling
Control PC
Console table
Scrubber
Coatings:
Materials / Mode
Metals: Copper, Gold, Silver, Aluminium, Molybdenum, Titanium / DC
Alloys: Ni/Cr 80/20 / DC
Dielectrics: ITO, AI:ZnO / DC
SiOx, AI2O3, TiO2 /MF
ZnO / DC, MF
System cooling water:
Inlet pressure: 4 to 6 bar
Outlet pressure: Pressure-less, Open drain
Consumption: Maximum 50 m³/h
Average consumption: Approximate 26 m³/h
Temperature (Inlet): Minimum 18°C, Maximum 22°C
Temperature rise: Maximum 6°C
Carbonate hardness: <6 to 8°
pH value: 8.5 to 10
particle size: Maximum 100 μm
Particle concentration: Maximum 10 parts/cm³
CO2-content: Maximum 15 mg/l
CI-content: Maximum 20 mg/l
Cathode cooling circuit:
Filling quantity: Approximate 1100 Liters
Carbonate hardness: <7°
pH value: 8.0 to 9
Particle size: <5 µm
Solved oxygen: Maximum 5 mg/l
Resistivity at + 25°C: >2 x 103 Ohm cm
Compressed air:
Pressure: 6 to 7 bar
Average consumption: Approximate 1 m³/h
Particle size: Maximum 5 µm
Particle concentration: Maximum 5 mg/m³
Oil-content: Maximum 5 mg/m³
Dew point: 2°C
Gases: Argon, Nitrogen, Oxygen, Argon/Oxygen 80/20
Pressure: 1, 2 bar
Purity: 99.995
Gas tubing: Stainless steel, Coupling
Winding:
Web speed: 0.5 to 20.0 m/min + 0.1% of nominal speed at the motor shaft
Unwind / Rewind: 60 to 600 N
Tension measuring rollers with analog load cell
Vacuum:
Ultimate pressure: <8 x 10^-7 mbar in sputtering compartments of process modules
Pump down time to ultimate pressure: 24 Hours
Pressure during sputtering: 1 to 9 x 10^-3 mbar
Pump down time to 6 x 10^-6 mbar: <60 minutes
Measured at a pressure: < 2x10^-3 mbar
Gas separation factor between sputter compartments and sputtering compartments:
>100: 1, only for maximum substrate thickness loaded
Electrical Services:
Voltage: 400 V +10/-10% 50 Hz, 3 Phase, TN-network with loadable PEN for 60 Hz
Connected load: 320 kVA
Average consumption: Approximate 240 kW
Short circuit current: Maximum 50 kA
Process coating:
Magnetron sputtering coating technology
One coated side
Substrate width: Maximum 820 mm
Coating area web width reduced: 10 mm
Coating width: Minimum: 300 mm, Maximum: 600 mm
Environment:
Temperature: Minimum 15°C, Maximum 35°C
Humidity: Maximum 90% at 20°C, Maximum 50% at 35°C
Maximum altitude of installation site: 1000 m above sea level
2018 vintage.
AMAT Smartweb SL-3L/800 reactor is a cutting-edge thin-film deposition equipment designed for advanced semiconductor manufacturing processes. This sophisticated tool incorporates innovative technologies to achieve high levels of film uniformity, process control, and productivity. The SL-3L/800 reactor is part of APPLIED MATERIALS Smartweb series, known for its superior performance and reliability in the fabrication of integrated circuits and other electronic devices. At the core of the SL-3L/800 reactor is its advanced chamber design, which enables precise control over the deposition process. The reactor is equipped with a multi-zone temperature control system, allowing for the optimization of film properties across the substrate surface. This feature ensures excellent uniformity and consistency in film thickness, crucial for the performance and reliability of semiconductor devices. The SL-3L/800 reactor utilizes a high-throughput configuration, enabling the deposition of thin films on large batch sizes of substrates. This capability significantly enhances productivity and cost-effectiveness in semiconductor manufacturing operations. The reactor is designed to accommodate various substrate sizes, shapes, and materials, offering flexibility and versatility in production processes. One of the key features of the SL-3L/800 reactor is its advanced gas distribution unit, which ensures precise control over the gas flow and mixing within the chamber. This feature enhances the uniformity and purity of the deposited films, contributing to the overall quality of the semiconductor devices. The reactor is also equipped with a sophisticated pressure control machine, enabling stable process conditions and improved film properties. The SL-3L/800 reactor is integrated with AMAT / APPLIED MATERIALS proprietary Smartweb software platform, which provides comprehensive process monitoring and control capabilities. The software allows for real-time process optimization, fault detection, and data analysis, ensuring high process repeatability and yield. The Smartweb platform also enables remote monitoring and control of the reactor, facilitating operational efficiency and reducing downtime. In terms of deposition capabilities, the SL-3L/800 reactor supports a wide range of thin-film materials, including dielectrics, metals, and semiconductors. The reactor is capable of depositing films with precise thickness and composition control, vital for the fabrication of advanced semiconductor devices. Whether for front-end-of-line or back-end-of-line applications, the SL-3L/800 reactor offers the flexibility and performance required for cutting-edge semiconductor manufacturing processes. In conclusion, AMAT Smartweb SL-3L/800 reactor is a state-of-the-art thin-film deposition tool that combines precision, productivity, and reliability in semiconductor manufacturing. With its advanced chamber design, high throughput capabilities, and integrated software platform, the SL-3L/800 reactor delivers exceptional performance for the fabrication of next-generation electronic devices. This reactor represents a key technological advancement in the semiconductor industry, empowering manufacturers to meet the demands of evolving market trends and applications.
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