Used AMAT / APPLIED MATERIALS Twin chamber for Producer SE #293665501 for sale

AMAT Producer SE Twin Chamber Reactor is a robust, easy-to-operate, batch-processing equipment designed for high-rate etching and deposition of silicon wafers. This advanced two-chamber processing system provides ultimate process flexibility with the capability to handle etching, deposition, and combinations of both processes. The Producer SE Twin Chamber Reactor allows for high through-put processing and can achieve excellent film step coverage and high profile uniformity. The first chamber, the etch chamber, processes up to nine individually-controlled wafers and features and aggressive gas delivery unit and conductor wafer loading support. This chamber uses HF as a precursor to etch silicon oxide and nitride. Using the high-end technology such as advanced mass spectrometers and high sensitivity vibrate mass difussion device, etch rate and selectivity can be achieved and, when used in combination with the advanced surface temperature control and a closed-loop wafer loading machine, good process yields and reproducibility are obtainable. The second chamber, the deposition chamber, features an integrated vertical showerhead, which ensures excellent deposition uniformity and repeatability. The high-performance showerhead is supported by advanced exhaust and flow temperature measurement to ensure low contamination levels. The chamber is designed to handle two to six individually-controlled wafers and uses high-temperature films such as PECVD TEOS as its precursor. The closed-loop wafer loading tool and advanced mass spectrometry asset can be used to maximize deposition performance and achieves excellent film step coverage. The Producer SE Twin Chamber Reactor is designed for large-scale processing. The tranport model offers efficient automated handling of up to fifty wafers, further increasing the throughput of the equipment. It is an improved system with improved control software and advanced process monitoring capability. It allows for full customization of the process parameters for each step and offers extremely fast and easy setup. As a result, processes run at optimum conditions while improving yields and reducing cycle times. This advanced two chamber processing unit can offer the ultimate process flexibility for etching and deposition applications.