Used AMAT / APPLIED MATERIALS Ultima X #293754394 for sale

AMAT / APPLIED MATERIALS Ultima X reactor is a state of the art tool used for depositing thin films with unprecedented control over the uniformity of the deposition. It utilizes ultra-high vacuum technology, electron cyclotron resonance (ECR) plasma source and advanced process control to allow nanometer-level augmentation of performance and thickness uniformity of deposited thin films, with high throughput and maximum process reliability. AMAT Ultima X reactor provides fully automated process sequencing and closed-loop process control with adjustable pressure control, dual-zone wafer rotation, and advanced process metrology. This ensures that the most ideal working conditions are achieved, allowing for consistent and repeatable results. The ECR plasma source provides a uniform, highly energized oxygen plasma and has a wide process window which allows for a wide range of deposition processes, including etching, oxidation, deposition, annealing and film passivation. APPLIED MATERIALS Ultima X reactor also features an exchangeable linear motion stage that allows for fast and reliable wafer loading. It also features a transfer chamber for efficient wafer transfer between processing chambers, providing a high degree of process flexibility. Ultima X reactor is also capable of running multiple processes in parallel, providing large throughput and a high level of processing flexibility. The system can accommodate up to eight processes in a single chamber, which can be configured for multiple wafer sizes. AMAT / APPLIED MATERIALS Ultima X reactor provides both low temperature deposition and high temperature processing, allowing for ultra-low deposition temperatures without sacrificing process performance. This enables reliable and consistent deposition at high deposition rates. AMAT Ultima X reactor is a cutting edge tool that provides the highest levels of process control, repeatability and uniformity, while providing a high level of throughput and flexibility. It is an essential tool for obtaining the most reliable and reproducible results in the deposition of thin films.