Used AMAT / APPLIED MATERIALS Ultima X #9236849 for sale

AMAT / APPLIED MATERIALS Ultima X is a high-temperature, ultrahigh vacuum deposition equipment designed for precision film formation. This system uses an inductively coupled plasma (ICP) source to enable high precision thin film deposition of several materials on semiconductor substrates as well as other materials. This unit is designed to achieve extremely precise thin film thickness profiles, with optional laser interferometer and high-power quartz crystal monitor to control film thickness deposition. AMAT Ultima X reactor has a computer-controlled, sealed process chamber, and is equipped with a single source plasma source and integral exhaust machine. This tool has a wide range of adjustable process temperatures from room temperature up to 1050°C and can achieve deposition rates up to 200 nm/min. This high deposition rate makes it particularly suited for applications such as Copper barrier/liner applications that require a fast deposition rate. APPLIED MATERIALS Ultima X asset has a range of available accessories and features, which includes various gas control systems that can accurately control various gas flows and pressures, as well as an electrode-less powered planar source for deposition of high aspect ratio structures. The Ultra-High Vacuum (UHV) model can provide a base pressure of 10-7 Torr for precise deposition of ultra-thin layers with minimal contamination. Ultima X also includes a variety of computer aided design (CAD) software packages, which enables to program deposition jobs with ease. As well as planned deposition jobs, users can also experiment with deposition jobs and fine-tune them as needed. You can run single wafer/chamber level deposition or multiple wafer/chamber level deposition on this equipment. AMAT / APPLIED MATERIALS Ultima X is an ideal choice for thin-film deposition of Copper, Titanium, Tantalum, Graphite, Aluminium, Niobium, and Tungsten, as well as other materials, and is ideal for R&D, high-end manufacturing, and production systems. With its versatile design, it is a cost-effective way to meet complex deposition requirements.