Used AMAT / APPLIED MATERIALS Ultima X #9249285 for sale
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ID: 9249285
Wafer Size: 12"
Vintage: 2009
HDP CVD System, 12"
(2) Load ports
FI Alignment: FI Alignment fixtures
Atmospheric robots: YASKAWA XU-RCM6841
Monitors: Chase type (Rack)
Slit valve:
(2) Parker AD276510A
(3) VAT A-728585
Transfer chamber robots: STD Reach dual blade robot (Clear Lid)
Chiller: SMC INC-498-011C
Chamber A:
TMP: SHIMADZU TMP-H3603LMC-A1
Gas ring: 36
RPC: AX7670
Process Kit
Chamber B:
TMP: EDWARDS STP-XH3203P
RPC: AX7670
Process Kit
Chamber D:
TMP: EDWARDS STP-XH3203P
Process Kit
RF Generator type:
(6) MKS Spectrum 11002
(3) MKS Spectrum 10513
Gas configurations:
Chamber A:
Gas Size
Line 1 O2 1,000
Line 2 H2 1,000
Line 3 He 600
Line 4 SiH4 400
Line 5 Ar 1,000
Line 6 He 600
Line 7 H2 1,000
Line 8 SiH4 50
Line 9 Ar 50
Line 10 NF3 400
Line 11 NF3 5,000
Line 12 Ar 3,000
Chamber B:
Gas Size
Line 1 O2 1,000
Line 2 H2 1,000
Line 3 He 600
Line 4 SiH4 400
Line 5 PH3 20
Line 6 Ar 1,000
Line 7 PH3 10
Line 8 SiH4 50
Line 9 Ar 50
Line 10 He 600
Line 11 NF3 3,000
Line 12 Ar 3,000
Chamber D:
Gas Size
Line 1 O2 1,000
Line 2 H2 1,000
Line 3 He 600
Line 4 SiH4 400
Line 5 PH3 20
Line 6 Ar 1,000
Line 7 PH3 10
Line 8 SiH4 50
Line 9 Ar 50
Line 10 He 600
Line 11 NF3 3,000
Line 12 Ar 3,000
2009 vintage.
AMAT / APPLIED MATERIALS Ultima X is a reactor that is used for the deposition of material layers on wafers and other substrates. It has been designed for use in the semiconductor industry, and is considered to be one of the most reliable, precise, and productive reactors available today. AMAT Ultima X reactor is built for a wide range of deposition processes, such as chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), and more. Its design consists of a heated, insulated chamber with multiple levels of heating to enable precise deposition of the materials. It has chambers from two to eight, depending on the process requirements, and each chamber is outfitted with a delivery equipment that regulates the temperature, pressure, and gas flow rate for optimal results. APPLIED MATERIALS Ultima X offers a high level of performance and reliability. Its high temperature gradient, combined with its low thermal mass, enables high deposition rates that can reduce process times by up to 40%. Its advanced design also enables low temperature uniformity, low thermal drift, and higher lifetime performance. Ultima X also offers optional clean-in-place (CIP) and Rapid Solution Transfer (RST) features to ensure fast and efficient processing. AMAT / APPLIED MATERIALS Ultima X also offers an advanced control system to maximize unit efficiency and reliability. Its integrated control machine is designed for high performance and flexibility, and allows users to customize the tool's operation based on the specific needs of each application. It includes features such as in-situ diagnostics and calibration, high speed synchronization, integrated gas flow and temperature control, and more. Overall, AMAT Ultima X is an advanced, reliable, and high-performance reactor designed for deposition processes in the semiconductor industry. With its high deposition rate, low thermal drift, and integrated control asset, it is capable of delivering accurate, precise, and consistent results, even for highly demanding processes.
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