Used AMAT / APPLIED MATERIALS Ultima X #9255628 for sale

AMAT / APPLIED MATERIALS Ultima X is an ultra-high density plasma etch technology used in complex semiconductor device fabrication. It is an inductively coupled plasma (ICP) reactor, which means it leverages electromagnetic fields to create plasmas consisting of energetic ions and radicals that can be used in thin-film etching. The etching of thin film layers, such as those in nanoelectronic devices, is critical for speeding the data storage process in the fabrication of nanodevices and other semiconductor products. AMAT Ultima X is versatile because it is performant for all etch chemistries and materials. The reactor's unique structure consists of three concentric cylinders, enabling the reactive species and chemical precursors to move quickly, eliminating the occurrence of thermal energy deposition. This greatly improves the etch uniformity across the substrate. APPLIED MATERIALS Ultima X also uses a high-density source with low-pressure operation, which combines to create a very efficient etch process. This is accomplished by using the dual-drive power source that utilizes both the negative ions and the electrons to effectively ionize the plasma species. This high-density plasma equipment provides superior etch anisotropy over other processes, significantly reducing etch sidewall losses and enabling higher resolution features. Ultima X also incorporates a patented gas delivery technology that improves the etching process while mitigating contamination of the reactive species. This technology uses advanced computer-software algorithms to accurately control the pressure between the etch precursors and the substrate, ensuring that plasma species arrive at the substrate in ideal amounts and with minimal scatter. AMAT / APPLIED MATERIALS Ultima X also utilizes an advanced optical substrate inspection (OSI) system to ensure quality end-products. This unit uses visible and infrared light spectroscopy to detect silicon contaminants, gate oxide thickness, gate oxide damage and gate oxide failure. Additionally, AMAT Ultima X OSI machine is at the same time able to measure critical dimensions of the etch pattern in order to assure a high yield rate. Overall, APPLIED MATERIALS Ultima X is a feature-rich etch reactor with advanced capabilities. Its high-density plasma source, low-pressure operation and dynamic gas delivery paired with efficient end-product inspection ensure optimal etching performance and precision. Ultima X is used in a wide range of applications, such as developing sophisticated nanoelectronic devices, and is a highly reliable etch tool.