Used AMAT / APPLIED MATERIALS Ultima #9314618 for sale

AMAT / APPLIED MATERIALS Ultima is a sophisticated atomic layer deposition (ALD) reactor, specifically designed for the deposition of thin layers of material onto various substrates. AMAT Ultima is a research and development tool available for in situ evaluation, allowing for the reliable deposition of ultra-thin layers of materials onto substrates such as wafers, nanoparticles, and powder. APPLIED MATERIALS Ultima has been optimized for a wide range of thin film applications including: dielectrics, oxides, nitrides, metals, and materials for novel devices. Ultima ALD reactor operates through the principles of self-limiting surface-controlled chemistry, which is based on the adsorption of consecutive monolayers of precursor molecules onto the processed substrate. This unique reactor employs a combination of a highly controllable vacuum chamber, a high-precision mass flow controller (MFC) to precisely deliver precursors, a quartz crystal microbalance (QCM) for in situ process monitoring, an advanced rotating substrate holder for multi-layer and patterned processing, and a fast-loading cryopanel for rapid sample introduction. AMAT / APPLIED MATERIALS Ultima is capable of providing precise control over reaction parameters such as process pressure, gas flow rate, temperature, reaction times, and number of deposition cycles. The reactor's advanced control capabilities enable users to achieve precise control over the deposition process, as well as enabling the evaluation of different deposition processes in situ. Additionally, its automatic reaction cycles ensure reliable, repeatable results, ensuring an easy and efficient use of the system. The ALD process employed by AMAT Ultima is highly atomically precise. This accuracy allows for the deposition of uniform layers over large areas, as well as over a range of patterned substrates. The layers deposited by APPLIED MATERIALS Ultima are also extremely thin and conformal in nature, allowing for complex three-dimensional structures to be created with a high degree of repeatability and accuracy. Ultima is an extremely versatile and valuable tool for thin film deposition in both research and manufacturing environments. Its ability to accurately and reliably deposit highly conformal thin films in a wide range of applications makes it the perfect choice for those looking for precision, control, and accuracy in their ALD process.