Used AMAT Centura High-K #293616807 for sale

AMAT Centura High-K is a reactor equipment designed specifically for 300mm wafer fabrication. It is a type of reaction chamber to which etching gases can be sent in order to perform post implantation clean steps. The system is designed to minimize particulation by providing high-speed flow that rapidly removes particles before they can settle on the surface of the wafer. Notable features of Centura High-K include a dual-zone, parallel-flow effluent injection unit, acoustic focusing, chemical abatement, thermal management and process control programs, and efficient heat recovery systems. The dual-zone machine allows reactive gases to be injected into the reaction chamber with a high degree of accuracy and velocity. This reduces the amount of time required to complete the process and the number of particles that can contaminate the wafers. Acoustic focusing is another important feature of AMAT Centura High-K. This technology uses sound waves to create a channel of extremely focused etching gas that dissipates quickly after exiting the reaction chamber. This has the advantage of significantly reducing the chances of contamination as there is very little of the gas outside of the reaction chamber. Centura High-K also features chemical abatement options to ensure that high-level cleanroom regulations are met. This tool uses a series of filters and absorbers to trap and clean hazardous chemical emissions from the reaction chamber. Moreover, it has thermal management and control functions which allow for precise temperature control for repeatable results. Finally, AMAT Centura High-K comes with efficient heat recovery systems that reclaim energy from the process and use it to reduce total operating costs. This helps increase the equipment's performance and reduce any potential impacts to the environment. Overall, Centura High-K is an excellent and reliable reactor asset for 300mm wafer fabrication. It offers many advanced features such as acoustic focusing, chemical abatement, thermal management and control functions, and efficient heat recovery systems. All of these features come together to provide an excellent process experience and minimize contamination of the wafer.