Used APPLIED MATERIALS Endura 5500 #182849 for sale

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ID: 182849
Wafer Size: 8"
Vintage: 1994
System, 6" Umbilicals 25' Chamber 1: Ti 11.3 source STD Body MDX L6 Chamber 2: Tin 11.3 source Wide Body MDX L12 Chamber 3: AL 11.3 source STD Body MDX-L12 Chamber 4: Tin 11.3 source WB Body MDX L12 Chamber A Pass: PC I (Missing) Chamber F Orient: standard MFC/Baratron: STEC 4400 Loadlock / Cassette: Narrow body Locdlock Buffer/Transfer Robot HP Robot Blade x2 Compressor 8510 x 2 Cryo Pump 1 phase Heat Exchanger Neslab Stored in a clean room 1994 vintage.
APPLIED MATERIALS Endura 5500 is an advanced plasma-enhanced chemical vapor deposition (PECVD) reactor that is used to deposit films onto the surface of semiconductor wafers. Endura 5500 reactor is a piece of process equipment designed to provide excellent quality films in a precise, efficient and repeatable deposition process. It utilizes several methods for optimizing the deposition process, including varying a range of different plasma-related parameters. APPLIED MATERIALS Endura 5500 reactor uses advanced technology to generate a uniform plasma discharge that helps to create repeatable and reliable films. It features a metal-to-metal vacuum seal that eliminates the need for O-rings and other metal seals, allowing for very precise and repeatable pressure control. Additionally, the reactor features a thermal conduction-cooled gas distribution system with low dispersion pressure, ensuring even gas delivery to the wafers. Endura 5500 reactor can be configured to accommodate a variety of different processes, including magnetron sputtering and reactive sputtering, as well as other Plasma Enhanced Chemical Vapor Deposition, PECVD and Etch processes. The reactor is also equipped with a high-performance process computer system that enables precision of the processes. The reactor can be remotely monitored and provides real-time monitoring and feedback of process results. APPLIED MATERIALS Endura 5500 reactor also features advanced hardware and software advancements that greatly increase process throughput and yield. It is capable of delivering film deposition rates as high as 60nm/sec and features several features designed to improve process repeatability and reproducibility, including a constant gas distribution system, local and global RF matching, dual chamber simultaneous operations, and dynamic RF and independent bias control. Finally, Endura 5500 reactor is proven to successfully produce high quality, ultra-smooth films onto the surface of the wafers. This can provide a variety of benefits, including improved resistance to tears and scratches, improved dielectric properties, and increased resistance to chemicals and wear. Additionally, APPLIED MATERIALS Endura 5500 reactor can be used to easily deposit films onto large wafers for various electronic devices, including solar cells and storage devices.
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