Used ASM Eagle 10 Trident #293830299 for sale
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ID: 293830299
Wafer Size: 8"
Vintage: 2003
Plasma Chemical Vapor Deposition (CVD) system, 8"
2003 vintage.
ASM Eagle 10 Trident is a state-of-the-art ultrasonic wire bonding machine. It is designed for applications that require high precision and repeatability, and it is capable of producing fine pitch and very sophisticated interconnections. Its advanced features include an ultrasonic module, a heated capillary platform, an integrated vision equipment, and a fully automatic vision set-up. Eagle 10 Trident utilizes a unique and sophisticated bonding technique called an "ultrasonic" technique, which uses ultrasound pulses to bond electrical wires to the pads of a circuit board. This technique requires higher levels of precision than other bonding techniques, since the ultrasound pulses require accurate placement and timing in order to create a secure connection. The ultrasonic module on ASM Eagle 10 Trident helps ensure a reliable connection by using typical frequencies between 20-25 KHz and a power output of up to 450W. The heated capillary platform is designed to amplify the amplitude of the ultrasound pulses and enable power to reach a depth of 200um in the board. The integrated vision system allows for automated wire placement, thickness recognition, and photo-detection. This unit also provides complete vision set-up to align the capillary to any position on the board, which allows for reliable and exact placement of wire. In addition, Eagle 10 Trident is equipped with a high-tech monitoring machine that ensures accuracy and repeatability. The machine has real-time feedback of all the process parameters, which aides in process control and monitoring. All data gathered by the unit is captured and stored in the internal memory. Overall, ASM Eagle 10 Trident is a highly reliable and accurate bonder that is ideal for applications requiring automated wire bonding, fine pitch/wire spacing, and material consistency. This machine is highly recommended for any production environment that requires fast, reliable, and precision bonding.
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