Used ASM Eagle 10 #293819962 for sale

ASM Eagle 10 is a state-of-the-art, high-end wafer bonder specifically designed for the integration of dies onto packages utilizing a wide range of bonding techniques. Suitable for both manual and automated assembly, it provides a variety of features such as an intuitive operator interface, high accuracy alignment, and customizable process steps. ASM EAGLE-10 utilizes a series of laser streams, optics and interferometers to measure the physical properties of a wafer and its components. The system is capable of performing a comprehensive range of alignment techniques, including measuring the outside edge of die, analyzing the die's position in 3D, and optionally providing a 6-axis alignment of the wafer with the assembly tooling. Furthermore, the system offers a number of features which allow for repeatable cycle times and an increased throughput rate. In addition to providing a comprehensive range of features relating to die and package alignment, Eagle 10 also supports a number of bonding techniques. Amongst these are thermal compression, thermosonic, and flat die attach. With thermal compression, a bead of metal is deposited onto the bond area, and then a heated bonder tool compresses the metal, creating a strong bond between the dies and the substrate. With thermosonic bonding, the die is vibrated at a certain frequency and vibration amplitude, which creates a strong intermetallic bond between the two pieces. Finally, flat die attach is a bonding technique which requires two pieces of metal foil to be attached together, and then the die is die-attached on top of the metal foil. EAGLE-10 also features an intuitive operator interface which allows the user to customize various operational parameters. Features such as desired cycle times, temperature settings for bonding, and force feedback can all be adjusted to suit the requirements of the operation. Additionally, a wide range of safety features are provided to ensure the safety of both the bonding process and the operator. In summary, ASM Eagle 10 is a high-end wafer bonder that offers a range of features to facilitate precision bonding, along with a safe and user-friendly operator interface. The system's suite of alignment and bonding capabilities allow for the reliable integration of dies onto substrates and packages, enabling the assembly of complex microelectronic devices.