Used ASM Eagle XP4 #293625765 for sale

ASM Eagle XP4 is a high-end ultra-high precision vision-aided ball bonder with superior bonding capabilities. It is designed for high speed and high accuracy assembly of high performance microelectronic components. The system has four separate, integrated components for bonding, thrumming and test. It features an improved bondhead mounted HD video camera, providing a wide field of view and highly detailed images. This enables faster and more accurate inspection of bondwire and diepad surfaces, while allowing for in-process quality control. Eagle XP4 features a fully automated, high speed bonder module. This module can bond components as small as 0.1mm pitch and 0.25mm wire size, with a force capacity as high as 30-N. This module is capable of automatically placing, forming, and inspection of wirebonds and forming hooks. The bondhead communicates wirebond information to the bonder controller, with the assistance of an advanced software package that uses exact BGA location identification, programmable working parameters, and external monitoring default parameters. The thrumming station, an additional feature of the XP4, helps to reduce cycle times and ensures product integrity by inspecting for wirebond pitch accuracy, wirebond wrinkle integrity, and other misalignments or irregularities. Using advanced vision algorithms, the system detects, optimizes, and corrects for pitch or height differences between individual wires. Visual thrumming pinpoints problem areas quickly and ensures a clean product finish. ASM Eagle XP4 also offers a test station, a complete inline test system that verifies product quality and performance. This test station includes both standard digital and analog test nodes, as well as a specialized digital photoacoustic test node. This test node is capable of detecting minute surface and subsurface defects, including moisture and corrosion. Eagle XP4 is a powerful and highly reliable ball bonder, offering superior performance in both manufacturing and testing operations. Its innovative features make it well suited for a wide range of microelectronics assembly tasks, and its advanced technology ensures optimal yield and product reliability.