Used LAM RESEARCH Inova NExT #9350861 for sale
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ID: 9350861
Wafer Size: 12"
Vintage: 2005
PVD System, 12"
(3) Chambers
2005 vintage.
LAM RESEARCH Inova NExT is a low-energy, advanced plasma reactor that enables the fabrication of advanced electronic devices. Inova NExT is designed for next-generation chip fabrication, such as Three-Dimensional (3D) transistors and flash memory. It features enhanced process control of high-resolution, lower-temperature, and higher-yielding fabrication platforms. LAM RESEARCH Inova NExT is equipped with a radio-frequency (RF) generator and an oxygen (O2) plasma source that support parallel dual-sided wafer processing. Its multi-source, multi-frequency generator enables precise plasma deposition and etching processes. Inova NExT's high-efficiency gas delivery equipment maintains low residual gases on the wafer surface, eliminating particles and reducing stress, allowing for uniform and repeatable film deposition profiles. LAM RESEARCH Inova NExT reactor utilizes a variety of high-resolution optical sensors and probes for real-time process monitoring. Its electrical probes sense and display the process temperature, pressure, and sputtering rate. Its advanced process control capabilities enable precise process step optimization and overall yield improvements. Inova NExT is designed with a highly reliable, low-maintenance vacuum pump system for the collection of gases from the chamber. The streamlined gas delivery unit maintains excellent control over gas flows and quantities and helps to reduce contamination. Its shielded RF machine ensures homogenous deposition and ensure no damage to control hardware due to EMI. LAM RESEARCH Inova NExT's self-cleaning operation helps to keep the process chamber clean and free of contaminants. Its heavy-duty chamber construction is made of 300 series stainless steel and features superior chamber heat capacity and uniformity. Inova NExT chamber size can be customized to fit any fabrication process. LAM RESEARCH Inova NExT can be equipped with variable angle wafer rotation, real-time angled view with wafer-level sensors for temperatures, pressure, and gas flow, along with multiple active temperature zones within the chamber for greater temperature control. It is built for long-term reliable operation and is capable of supporting repeatable, high-yield fabrication processes.
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