Used LAM RESEARCH / NOVELLUS Concept 2 Dual Speed Sequel #9251470 for sale

LAM RESEARCH / NOVELLUS Concept 2 Dual Speed Sequel
ID: 9251470
Wafer Size: 8"
Vintage: 2001
CVD System, 8" 2001 vintage.
LAM RESEARCH / NOVELLUS Concept 2 Dual Speed Sequel (DSS) reactor is an industrially proven technology designed for manufacture of plasma etch, chemical vapor deposition and physical vapor deposition. The DSS reactor is a versatile equipment, combining the best features of LAM and NOVELLUS technologies into a single platform capable of performing all deposition and etch processes. The DSS offers a large etch chamber with excellent uniformity, high throughput and flexibility in gas chemistry. NOVELLUS Concept 2 Dual Speed Sequel reactor was designed to deliver outstanding plasma etch performance and control. The etching process is highly reproducible and uniform, leading to precision features and narrow target profiling. The advanced plasma etch system offers high throughput and low contamination levels, allowing for higher yields and faster time to market. The DSS also includes a Chemical Vapor Deposition (CVD) unit, which is used to deposit thin films of materials such as silicon, silicon dioxide, and metallic compounds for semiconductor device fabrication. The CVD machine is capable of high temperature operation, enabling team deposition of hard materials such as silica and diamond-like carbon. The tool offers superior uniformity and reduced contamination for high yields. In addition, LAM RESEARCH Concept 2 Dual Speed Sequel reactor offers the Physical Vapor Deposition (PVD) process. PVD can be used to deposit thin metal films for contact metals, metal interconnects, and other electrical components. The PVD asset is highly reliable and repeatable, offering excellent adhesion and deposition uniformity with minimal particle generation. Concept 2 Dual Speed Sequel reactor offers an impressive feature set, including advanced gas chemistry, low contamination, high throughput, state-of-the-art control capabilities, and a variety of different processes in a single platform. These features make the model an ideal choice for semiconductor and other thin-film device manufacturing processes.
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