Used LAM RESEARCH / NOVELLUS Concept 2 Sequel-X #9293855 for sale

LAM RESEARCH / NOVELLUS Concept 2 Sequel-X is an advanced concept in semiconductor reactor design. It's a unique plasma etch tool that combines the power and capability of a conventional plasma etch with a unique barrierless etch process. This makes it ideal for meeting the most demanding lithography requirements for aggressive, high-density device fabrication. It also offers unprecedented process flexibility and scalability. NOVELLUS Concept 2 Sequel-X reactor is designed to provide an unusually balanced combination of features and flexibility - a mixture of good etch capability and improved capability over a range of processes. It features dual frequency plasma capability to permit separate treatment of aggressive ions from those that will provide more uniform etch with improved control over the etching depth and shape. As such, it's extremely versatile and highly adaptive to different applications and an array of metal and dielectric surfaces. The Sequel-X reactor is equipped with proprietary cooling technology and can be set up to handle substrate temperatures of up to 400°C. This cutting-edge thermal management ensures balanced temperature distribution throughout the chamber, eliminating hot spots and hot edges. It also allows for extended production run times, increased productivity, as well as improved process yields. Some other key features of LAM RESEARCH Concept 2 Sequel-X include its patented dual magnetic field generator, capable of independently controlling the ion density and energy distribution; its integrated floating end plate design, which stabilizes the plasma distribution, minimizing variations throughout the chamber; and its high frequency RF generator, which permits an increased etch rate up to 2µm of silicon. In summary, Concept 2 Sequel-X is a truly revolutionary reactor design, offering breakthrough process flexibility and scalability suitable for the most demanding applications. Its advanced cooling technology, dual frequency plasma, dual magnetic field generator, integrated floating end plate design, and high frequency RF generator make it capable of meeting the most exacting lithography requirements while delivering unprecedented process efficiency.