Used LAM RESEARCH / NOVELLUS Sequel #293614939 for sale

LAM RESEARCH / NOVELLUS Sequel
ID: 293614939
Wafer Size: 8"
Vintage: 1995
CVD System, 8" 1995 vintage.
LAM RESEARCH / NOVELLUS Sequel is a combined physical vapor deposition (PVD) and etch (RIE) process tool for microelectronic device fabrication. This tool is used for applications such as, forming layers of conducting and dielectric materials on the surface of a substrate and creating device patterns such as contacts and vias. The sequencial process of NOVELLUS Sequel tool is split into two part separation. The first part is the physical vapor deposition (PVD) process which is used to deposit the conducting and dielectric material layers. This part constitutes to an ultra-high vacuum chamber that contains the substrate when the layer of material is applied. The material is evaporated from a heated source and then condensed on the surface of the substrate resulting in a uniform layer. The second part of this process is the etch (RIE) step which is used to define the features such as contacts and vias into the material layers. This step is accomplished by using a highly reactive plasma to excite the donor molecules. This process serves as a mechanism to remove certain materials or features in a precise manner that is usually difficult to achieve using traditional etch techniques. The controlled etch rate on the materials is then affected by the radio frequency power that controls the density and energy of the plasma. LAM RESEARCH Sequel process provides higher quality surface processing by incorporating the two processes into one system allowing the physical and chemical process steps to be combined in a single tool. With this dual-process step, the customer can achieve higher precision and improved repeatability for device fabrication. The two-step process is also capable of desirable aspects such as precise patterning control to decrease the layer thickness of feature sizes. To summarize, Sequel tool is a state-of-the-art reactor tool designed to enable precise fabrication of microelectronic devices. It employs a dual-process chamber in order to perform the physical vapor deposition (PVD) and etch (RIE) steps simultaneously. This cutting-edge LAM RESEARCH / NOVELLUS Sequel technology allows for higher precision and better repeatability with regards to device feature patterning.
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