Used LAM RESEARCH Sabre 3D #9300020 for sale

LAM RESEARCH Sabre 3D is a three-dimensional inductively-coupled reactive sputter deposition chamber, designed to provide precision sputter deposition of thin films. Sabre 3D's unique high-efficiency density control mechanism enables the deposition of particles of exact thickness and composition, allowing for greater control over film deposition. LAM RESEARCH Sabre 3D's powerful inductive-coupled plasma (ICP) source creates an intense energy field, which causes particles to be sputtered from the target material at a high rate. This ensures consistent and uniform film deposition, resulting in excellent coating performance. Sabre 3D has two independent plasma sources, one mounted in the lower chamber and the other in upper chamber, allowing the deposition of material on two substrates in the same run. The main advantages over conventional sputtering systems are the higher deposition rates, improved uniformity, and reduced defectivity. In addition to offering high rate deposition, LAM RESEARCH Sabre 3D also offers superior surface preparation and etching capabilities. The meshed cathodes and innovative filament geometry create an intense field for plasma etching, resulting in superior surface preparation and improved film uniformity. Sabre 3D can also be used for etching of the substrates prior to deposition, enabling high productivity and improved process control. LAM RESEARCH Sabre 3D also comes with advanced process monitoring and control capabilities. It is equipped with an advanced control system that constantly monitors process parameters, enabling greater control over this critical step in film deposition. Process control tools such as process tuning, automated process control, and statistical process control (SPC) are also readily available. Overall, Sabre 3D is a highly versatile and efficient inductively-coupled reactive sputter deposition chamber, designed to provide precision sputter deposition of thin films. Its advanced process monitoring and control capabilities, superior surface preparation and etching capabilities, and excellent rate deposition make it an excellent choice for demanding thin-film deposition applications.