Used NOVELLUS Concept 2 Altus Shrink #9180728 for sale

NOVELLUS Concept 2 Altus Shrink reactor is a versatile tool for semiconductor device fabrication, allowing the fabrication of high-precision nanometer-scale transistors with different structural designs. Concept 2 Altus Shrink reactor is a chemical vapor deposition (CVD) tool which allows for the deposition of a wide range of film materials for device fabrication. The tool incorporates advanced plasma CVD chemistry for precise depositing of single layers of material with atomic-level precision. NOVELLUS Concept 2 Altus Shrink reactor is designed to enable fast deposition rate, providing uniform thickness over large surface areas. This capability is attainable by optimizing the pressure and gas flow rate as the wafer chamber is shrunk. In combination with ultra-high vacuum and lower pressures than other more conventional CVD reactors, Concept 2 Altus Shrink reactor is highly optimized for critical layer thickness depositions. It can deposit various etch resistant materials for superior device protection and deposition of metal-dielectric films of various thicknesses for different device structures. NOVELLUS Concept 2 Altus Shrink reactor can also create high-aspect-ratio features for molded gate structures, allowing superior design flexibility. Additionally, the tool is capable of depositing conformal nanolayers of polymer or carbon-nitride material for gate insulation and advanced metal gates. Concept 2 Altus Shrink reactor is also capable of a range of pre-heating temperatures for better control of film thickness, as well as a variable post-anneal function for high-quality, durable deposition. Additionally, it has high film throughput and production efficiency, as well as embedded diagnostics. It is a fully integrated gas delivery system which includes recipe control, mass flow controllers, MFC monitoring, and online gas purging and monitoring capability for traceable results. NOVELLUS Concept 2 Altus Shrink reactor has precisely designed process chambers for improved uniformity of deposition over large areas with minimal temperature fluctuation, as well as improved process stability for predictable results. The tool also has automated wafer transfer, including wafer loading, unloading, rubber-stop wafer chucks, and number of wafers per recipe. It is also capable of state-of-the-art process control, with an easy-to-use graphical user interface and in-situ metrology for feedback and quality control.