Used NOVELLUS CONCEPT 2 Altus #181297 for sale
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ID: 181297
Wafer Size: 8"
Vintage: 1996
Dual Shrink W-CVD Chemical vapor deposition system, 8"
Chamber Location
1 Station Left Loadlock
2 station Process Module
3 station Process Module
4 station Right Loadlock
5 Station Cooling Sation
Electrical Requirements
AC power Voltage 208 VAC
DLCM Configuration
Indexer Type: Animatic Controller
Brooks Robot Type: Mag7
Host Interface: GEN/SECS
Controller Type : P166/64M/QNX4
DLCMS Type: Only Hi
Module Interface Type: Arc-net Type
IOC : Ver 4.1
TM Manometer 1 torr/ 100mtorr: Tylan General
L/L Manometer 100torr: Tylan General
L/L Convectron: Not Install
Module Door Type: SMC L-Motion
Chamber A:
Process Option BLKT
Clean Option Insuts Clean
MOER Ceramic M/A / M/B (Not Used)
Throttle Valve Type Tylan General 1ea
MFC Type & Size
Brooks 5964:
Ar (5000Sccm)
Ar (10000Sccm)
Area FC980C:
NH3 (150Sccm)
Brooks 5964:
Ar (10000Sccm)
Ar (20000Sccm)
Ar (20000Sccm)
H2 (20000Sccm)
H2 (20000Sccm)
Area FC980C:
B2H6, N2 (750Sccm)
Brooks 5964:
C2F6 (2000Sccm)
SAM MC4VLZ24:
WF6 (1000Sccm)
Brooks 5964:
O2 (2000Sccm)
SiH4 (1500Sccm)
SFC1480FPD:
SiH4 (300Sccm)
Slip Valve Type: SMC L-Motion
Chamber B:
Process Option BLKT
Clean Option Insuts Clean
MOER Ceramic M/A / M/B (Not Used)
Throttle Valve Type Tylan General 1ea
MFC Type & Size
SPEC 7330:
Ar (5000Sccm)
Ar (5000Sccm)
NH3 (1000Sccm)
NH3 (1000Sccm)
Ar (20000Sccm)
Ar (5000Sccm)
Ar (15000Sccm)
H2 (5000Sccm)
H2 (20000Sccm)
B2H6, N2 (750Sccm)
C2F6 (2000Sccm)
WF6 (750Sccm)
O2 (2000Sccm)
SiH4 (1000Sccm)
Slip Valve Type SMC:
L-Motion
1996 vintage.
NOVELLUS CONCEPT 2 Altus is a highly specialized and advanced PVD (Physical Vapor Deposition) reactor equipment. It is commonly used to apply thin films of deposited material onto large-scale substrates such as silicon wafers for use in semiconductor, optoelectronic and microelectronic devices. CONCEPT 2 Altus system is designed to provide a high level of process control, uniformity and flexibility with the goal of optimizing process yield. The PVD chamber is driven by a linear motor which provides a steady, stable environment for uniform deposition. It also features variable substrate sizes, adjustable gun positions, multiple zones and two sources of deposition materials, which help to maximize process uniformity and throughput. The chamber also features a fast, high-precision robotic arm which moves and loads materials into the chamber quickly and accurately. NOVELLUS CONCEPT 2 Altus unit is equipped with a variety of sensors and controllers which continually monitor the process and provide detailed feedback on the uniformity of the reaction. This ensures that the highest possible quality and repeatability of the thin films is achieved. The machine also includes proprietary software which can be used to monitor, evaluate and adjust the deposition process in real time. CONCEPT 2 Altus tool offers users greater control of process parameters, greater accuracy and repeatability, and improved process stability. It is an ideal asset for those looking to apply high-quality thin films to large-scale substrates quickly and efficiently. The combination of superior performance, repeatability and flexibility make NOVELLUS CONCEPT 2 Altus model the perfect choice for high-volume PVD applications.
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