Used NOVELLUS CONCEPT 2 Altus #181297 for sale

Manufacturer
NOVELLUS
Model
CONCEPT 2 Altus
ID: 181297
Wafer Size: 8"
Vintage: 1996
Dual Shrink W-CVD Chemical vapor deposition system, 8" Chamber Location 1 Station Left Loadlock 2 station Process Module 3 station Process Module 4 station Right Loadlock 5 Station Cooling Sation Electrical Requirements AC power Voltage 208 VAC DLCM Configuration Indexer Type: Animatic Controller Brooks Robot Type: Mag7 Host Interface: GEN/SECS Controller Type : P166/64M/QNX4 DLCMS Type: Only Hi Module Interface Type: Arc-net Type IOC : Ver 4.1 TM Manometer 1 torr/ 100mtorr: Tylan General L/L Manometer 100torr: Tylan General L/L Convectron: Not Install Module Door Type: SMC L-Motion Chamber A: Process Option BLKT Clean Option Insuts Clean MOER Ceramic M/A / M/B (Not Used) Throttle Valve Type Tylan General 1ea MFC Type & Size Brooks 5964: Ar (5000Sccm) Ar (10000Sccm) Area FC980C: NH3 (150Sccm) Brooks 5964: Ar (10000Sccm) Ar (20000Sccm) Ar (20000Sccm) H2 (20000Sccm) H2 (20000Sccm) Area FC980C: B2H6, N2 (750Sccm) Brooks 5964: C2F6 (2000Sccm) SAM MC4VLZ24: WF6 (1000Sccm) Brooks 5964: O2 (2000Sccm) SiH4 (1500Sccm) SFC1480FPD: SiH4 (300Sccm) Slip Valve Type: SMC L-Motion Chamber B: Process Option BLKT Clean Option Insuts Clean MOER Ceramic M/A / M/B (Not Used) Throttle Valve Type Tylan General 1ea MFC Type & Size SPEC 7330: Ar (5000Sccm) Ar (5000Sccm) NH3 (1000Sccm) NH3 (1000Sccm) Ar (20000Sccm) Ar (5000Sccm) Ar (15000Sccm) H2 (5000Sccm) H2 (20000Sccm) B2H6, N2 (750Sccm) C2F6 (2000Sccm) WF6 (750Sccm) O2 (2000Sccm) SiH4 (1000Sccm) Slip Valve Type SMC: L-Motion 1996 vintage.
NOVELLUS CONCEPT 2 Altus is a highly specialized and advanced PVD (Physical Vapor Deposition) reactor equipment. It is commonly used to apply thin films of deposited material onto large-scale substrates such as silicon wafers for use in semiconductor, optoelectronic and microelectronic devices. CONCEPT 2 Altus system is designed to provide a high level of process control, uniformity and flexibility with the goal of optimizing process yield. The PVD chamber is driven by a linear motor which provides a steady, stable environment for uniform deposition. It also features variable substrate sizes, adjustable gun positions, multiple zones and two sources of deposition materials, which help to maximize process uniformity and throughput. The chamber also features a fast, high-precision robotic arm which moves and loads materials into the chamber quickly and accurately. NOVELLUS CONCEPT 2 Altus unit is equipped with a variety of sensors and controllers which continually monitor the process and provide detailed feedback on the uniformity of the reaction. This ensures that the highest possible quality and repeatability of the thin films is achieved. The machine also includes proprietary software which can be used to monitor, evaluate and adjust the deposition process in real time. CONCEPT 2 Altus tool offers users greater control of process parameters, greater accuracy and repeatability, and improved process stability. It is an ideal asset for those looking to apply high-quality thin films to large-scale substrates quickly and efficiently. The combination of superior performance, repeatability and flexibility make NOVELLUS CONCEPT 2 Altus model the perfect choice for high-volume PVD applications.
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