Used NOVELLUS CONCEPT 2 Altus #9095522 for sale
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ID: 9095522
Wafer Size: 8"
Chemical vapor deposition (CVD) system, 8"
Process: Shrink DLCM
Non-shrink process modules
SSD Module: Dual chamber
Wafer type: Notch
SECS/GEM Software: No
Standard chamber
Mainframe options:
System controller: MC3
Signal tower: No
AC Power rack: Standard
Interconnect cables: No
DLCM
User interface: Adjacent to system
Transfer robot type: BROOKS MTR 5
Paddle type: Standard
Shuttle type: Standard
Cassette type: No
Indexer type: Type II
Cool station: No
SMIF loader type: No
Manometer: Standard 100 Torr
Facilities configuration: Either
Control system: QNX4
Pump electrical interface: No
Missing parts:
Animatics type
Leak check shutoff valve
Process module A: Altus
Controller type: MC3
IOC Version: 3.02
Gate and throttle valve: Internal, non-heated
Process manometer: 100 Torr non-heated
Heater pedestals: D-Type
Shower heads: Yes
MOER Rings: No
Spindle assy seal type: Ferrofluidic
X-Y Centering station: Yes
Viewport window: Sapphire
RF Match: Trazar
Chamber process: Tungsten plug fill
Full face coverage
Module location: Center port
Standard footprint
Facility connections: Rear of chamber
Module location: Center port (default)
Missing parts:
RF High frequency generator
Endpoint detector
Gas box: Standard 10 channel
MFC Type: BROOKS 5964
MFC Size and location
Channel Gas Flow (SLM)
1 Argon 2 SLM
2 Sih4 50 sccm
3 Hydrogen 20 SLM
4 Argon 20 SLM
5 Wf6 Missing
6 C2F6 2 SLM
7 Oxygen S SLM
8 Argon 10 SLM
9 Hydrogen 20 SLM
10 Nitrogen 10 SLM
Process module B: Altus
Gate and throttle valve: Internal, non-heated
Process manometer: 100 Torr non-heated
Heater pedestals: D-Type
Shower heads: Yes
MOER Rings: No
Spindle assy seal type: Ferrofluidic
X-Y Centering station: Yes
Viewport window: Sapphire
RF Match: Trazar
Chamber process: Tungsten plug fill
MOER Rings
Sequel process module A center port
Standard footprint
RF Generator: No
Optical endpoint detector: Yes
Facility connections: Rear of chamber
Module location: Right port
Missing parts:
RF High frequency generator
Controller type
Gas box: Standard 10 channel
10 Gas, missing 9 gas sticks
MFC Size and location
Channel Gas Flow (SLM)
5 Wf6 750 sccm
(1-10) Missing.
NOVELLUS CONCEPT 2 Altus (C2A) is a high-performance reactor designed for plasma etching, deposition, and sputtering applications in the semiconductor industry. The equipment utilizes patented vertical magnetic technology that combines high power with a large electrode area to achieve superior process stability. The C2A reactor is powered by a 30 kW HF generator which allows it to process large-area substrates with faster throughput than a standard reactor. The reactor also features an advanced auto-tuning system that enables it to quickly and accurately optimize the plasma process parameters for each wafer processed. The C2A features a unique vertical magnetic field that is capable of producing higher plasma temperatures and lower density than a standard reactor. This higher energy plasma enables improved etch rates and improved uniformity. The C2A also utilizes an adjustable upper electrostatic shield to prevent plasma contamination and a floating chuck to maintain a consistent substrate temperature. The C2A also features multiple chambers for greater processing flexibility. This allows users to perform multiple processes simultaneously or in sequence. The C2A's advanced gas management unit ensures gas flow uniformity and total gas control. This ensures that the process parameters remain consistent regardless of substrate size or number of substrates processed. The C2A is also equipped with an advanced control machine that allows users to monitor, adjust, and optimize the process parameters in real-time. This tool utilizes an advanced user interface for easy operation and software that enables users to create and store process recipes for different substrates and applications. CONCEPT 2 Altus (C2A) is a highly reliable, advanced reactor designed for semiconductor processing in the plasma etch, deposition, and sputtering arenas. Its 30 kW HF generator, adjustable upper electrostatic shield, and floating chuck ensure superior process stability while its vertical magnetic technology, adjustable gas management asset, and superior control model ensure superior performance. The C2A is the ideal choice for any semiconductor processing facility.
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